Technical Library | 2021-09-02 08:17:07.0
We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com
Technical Library | 2016-10-06 15:13:02.0
One of the methods gaining in popularity for singulating rigid/flex, rigid and flex circuit boards post assembly is through the use of laser routing. This method has the advantage of speed, positional accuracy, no tooling wear and lastly no induced mechanical stresses on components during the singulating process.
Technical Library | 2007-02-01 10:08:40.0
The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.
Technical Library | 2024-05-16 16:06:24.0
Much like actual cities where streets and roads connect buildings together, ICs on a board are connected to each other with copper traces. And just like any metropolitan city, urban expansion tends to move vertically instead of horizontally, but instead of multi-story buildings, we get multilayer boards. Vias are copper-plated holes spanning through the different layers of a given board or panel. They are the entrance locations to the subway stations, if you will. Having those multilayer boards has enabled electronic design to minimize the size of boards immensely without compromising on the complexity.
Technical Library | 2024-10-24 13:42:08.0
The techniques used for laser cutting molybdenum.
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An introduction to laser engraving, with applications and why laser engraving is used.
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Reviews Laser routing using an ablation process.
Technical Library | 2021-12-21 23:21:34.0
Points of discussion in "HDI Microvia Technology – Cost Aspects" are: - Reasons for the use of HDI technology - Printed circuit board (PCB) size - Number of layers - Stack-up and complexity - Other important cost influences -–Design rules -–Drilling costs -–Microvia filling
Technical Library | 2024-05-22 14:55:19.0
This article reviews UV or ultraviolet laser technology. Is on method that can be used for laser depaneling or singulation for precision control.
Technical Library | 2024-12-17 16:17:48.0
The article reviews what are fiber lasers, specifications of them and when would you want to use this type of laser technology.
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