Technical Library | 2019-05-17 01:50:39.0
Dry cabinet is especially designed with fully automatic humidity control to prevent moisture related defects. This cabinet is the optimal storage expert for SMT/BGA/PCB/IC electronic components.Our newly developed design greatly increases dehumidifying system which runs faster and more reliable compare to those traditional dry cabinets. it decreases the defective rate at production line.
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2019-01-23 21:33:32.0
Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process, reducing the Cost of Repair as the AOI systems identify the specific components that are failing removing the need for any additional test troubleshooting1-3. Because of this, more Electronic Contract Manufacturing Services (EMS) companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of component package 03015 which is challenging for AOI.
Technical Library | 2010-10-13 17:29:21.0
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So, it is necessary for everyone, who handles electrostatic sensitive devices (ESDS), to know the reasons of such failures. This presentation will give
Technical Library | 2011-07-14 17:47:11.0
In this paper, the concept for the next generation of resist stripper solutions is introduced, with specific emphasis upon development of new solutions targeted at the ever demanding fine line applications. The novel formulation used minimises the initial
Technical Library | 2010-12-22 13:59:14.0
This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2012-07-27 11:18:29.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo
Technical Library | 2014-09-25 18:16:47.0
For the past few years there has been a shift in the Lighting Industry that has carried over to the surface mount technology assembly line. What is this shift you may ask? Well it is the LED revolution. This revolution or change in lighting has some very promising results already in practice and many more companies looking to implement the LED technology into their product portfolio's. With a number of companies looking to expand their portfolio to include LED fixtures there has been an increase in the number of companies that have started their own SMT lines, as well as a significant number of contract manufacturers to meet this new industries demands (...)This presentation will discuss some issues in the pick and place process for LEDs and presents a method to troubleshoot and resolve these issues.
Technical Library | 2016-01-12 11:07:56.0
With the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, YINCAE has published a white paper on a first individual solder joint encapsulant which can eliminate underfilling process with at least five times solder joint increase and provide more flexibility for fine pitch and high density application. In order to meet the demand of manufacturing of high speed and low cost, YINCAE has invented a room temperature stable and jettable solder joint encapsulant adhesive – SMT 266. The invention of SMT 266 has allowed our customers to have more flexibility in their high-speed production line such as worry free on the work life of adhesive and workable jetting process.
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