Technical Library | 2022-04-29 00:49:12.0
Tools: soldering iron, soldering iron stand, wet sponge, tweezers, rosin, solder, absorbent cotton, 95% alcohol, chip resistors, capacitors, circuit boards, 220V power supply..... http://www.leadersmt.com/gen2/1028113523/?mod=file&col_key=download
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
Technical Library | 2014-05-29 13:48:14.0
Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance ( 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules.
Technical Library | 2021-06-15 18:36:00.0
To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology) production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 _m, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within _3%.
Technical Library | 2012-04-12 21:25:13.0
Surface mount technology (SMT) started in the 1960s and became more common in the 1980s. It is the dominant technology in use today. Through-hole technology is still in use, and will be for the foreseeable future, but the drive towards miniaturization of
| 1 |
