Technical Library | 2014-10-02 20:10:07.0
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As the results, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently.In this paper, we'll present the performance and process capability of various low/no silver alloy solder pastes. Data from printability, wetting test, slump test, solder ball test, voiding, etc… will be discussed and compared with the control SAC305 solder paste. Benefits and concerns of using low/no silver alloy solder paste materials will also be addressed.
Technical Library | 2015-02-05 20:25:41.0
In the past 20 yrs the solvent industry has gone through a great deal of change. In the early 1990s, CFC-113 and 1,1,1-trichloroethane were the workhorses of the industry. The Montreal Protocol to phase-out substances that deplete the Earth's protective Ozone Layer was implemented in the mid 1990s. After phase-out of the CFC solvents, the solvent industry fragmented to a variety of cleaning solutions. The electronics industry was a large user of CFC solvents and many of these applications changed to aqueous based cleaners (...) But those alternatives are now facing various problems: e.g. aqueous based cleaners use a lot of energy, require long drying times, use equipment that requires frequent maintenance, and require a large footprint; no-clean fluxes leave flux residues; and trichloroethylene and n-propyl bromide have toxicity issues. In response to these serious issues newer solvents and blends are being introduced in the marketplace
Technical Library | 2016-07-07 15:37:18.0
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers. In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made.
Technical Library | 2017-04-27 17:10:16.0
Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Understanding the effects of the laser energy to the substrate material properly is essential in order to take advantage of the technology without creating unintended side effects. This paper presents an in-depth analysis of the various laser system operating parameters that were performed to determine the resulting substrate material temperature changes. A theoretical model was developed and compared to actual measurements. The investigation includes how the temperature increase resulting from laser energy during depaneling affects the properties of the PCB substrate, which varies from no measurable change to a lowering of the surface resistance of the cut wall depending on the cutting parameters.
Technical Library | 2017-08-02 20:18:21.0
In this rapidly moving electronics market, fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little revealed that "New-Product Development (NPD) productivity in atop performing company is five times what it is in the average company. The top performer gets five times as much new product output for the same investment." What do they know that the rest of us do not? One winning factor is the use of the Robert Cooper process. (...)This paper will present a Lean Six Sigma approach to "right sizing" the Stage Gate process to be efficient, practical, and easy to manage. Various tools of Stage Gate, along with proven best practice, will be covered. In addition, a reduced Stage Gate model will be discussed for simple, low risk projects.
Technical Library | 2019-12-18 23:28:07.0
Electronic tongue systems equipped with cross-sensitive potentiometric sensors have been applied to pharmaceutical analysis, due to the possibility of various applications and developing new formulations. Many studies already proved the complementarity between the electronic tongue and classical analysis such as dissolution tests indicated by Pharmacopeias. However, as a new approach to study pharmaceuticals, electronic tongues lack strict testing protocols and specification limits; therefore, their results can be improperly interpreted and inconsistent with the reference studies. Therefore, all aspects of the development, measurement conditions, data analysis, and interpretation of electronic tongue results were discussed in this overview. The critical evaluation of the effectiveness and reliability of constructed devices may be helpful for a better understanding of electronic tongue systems development and for providing strict testing protocols.
Technical Library | 2020-01-09 00:00:30.0
PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
Technical Library | 2020-04-01 05:52:59.0
Recently, our engineer Peter went to Thailand to provide after-sales support for our customer. In these days, we had installed a SC-900 selective coating line . Moreover, Peter gave patience and meticulous training to their staff, make sure they master the machine usage .Customer and agent are satisfied with our support and give their affirmation to us. SC-900 is a high Performance 4 axis Selective Coating Machine ,which is equipped with high precision servo control system , various valves , CCD system ,material tank weight detecting system etc, which can provide a high efficiency conformal coating process .The maximum coating size can reach 400mm*450mm with SC-900. So far, we've installed several dozen conformal coating line all over the world. It have excellent stability and performance. Check below link to get more info!
Technical Library | 2020-04-01 23:32:29.0
Low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170 and 200oC soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices.Here we show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys are evaluated, and their results are analysed in terms of the alloy composition, including Bi content and alloying additions.
Technical Library | 2020-04-08 22:57:04.0
Flexible hybrid electronics (FHE), designed in wearable and implantable configurations, have enormous applications in advanced healthcare, rapid disease diagnostics, and persistent human-machine interfaces. Soft, contoured geometries and time-dynamic deformation of the targeted tissues require high flexibility and stretchability of the integrated bioelectronics. Recent progress in developing and engineering soft materials has provided a unique opportunity to design various types of mechanically compliant and deformable systems. Here, we summarize the required properties of soft materials and their characteristics for configuring sensing and substrate components in wearable and implantable devices and systems. Details of functionality and sensitivity of the recently developed FHE are discussed with the application areas in medicine, healthcare, and machine interactions. This review concludes with a discussion on limitations of current materials, key requirements for next generation materials, and new application areas.
