Technical Library | 2018-02-01 00:31:48.0
This paper briefly summarizes the technologies underpinning the evolution in electrical system diagnosis and repair, which include schematic layout automation using prototypes and rule-based styling, instant language translation, 2D/3D view links with schematics, interactive diagnostic procedures, and dynamically-generated signal-tracing diagrams. These technologies empower after-sales service teams with state-of-the-art capabilities, which not only reduce costs but also improve brand quality in the eyes of its customers.
Technical Library | 2020-02-13 08:41:18.0
Efficient bonding, sealing and potting has a major influence on the sustainable function and safety of electronic components. The key to success here lies in the comprehensive view and control of process engineering. Here it pays to seek collaboration with the systems and the material manufacturer during the very early stages of the project. This is because dispensing systems must be selected for compatibility with the workpiece and the adhesive, sealant or potting compound used. And there are also other factors that play an important role in designing the optimum dispensing system:
Technical Library | 2023-11-20 17:42:33.0
Zero-defect strategies and increased demands on the production of assemblies are making quality assurance in electronics production increasingly important. Continous miniaturization of components, ever higher packing densities and the associated hard-to-view assembly areas, as well as the increased use of components such as BGAs, QFNs and QFPs, pose a considerable challenge when it comes to high-precision quality control.
Technical Library | 2006-10-26 08:08:00.0
There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning. However, there is no single process change that is a sure cure for tombstoning! Those that claim otherwise are either uninformed or trying to sell you something. Rather than limiting your view to a single solution, EFD recommends you heed all of the studies. Like pieces of a puzzle, each study does not reveal the whole picture, but looked at all together, the picture is clear.
Technical Library | 2012-11-27 14:06:48.0
Quality managers and line supervisors are routinely tasked with the responsibility of ensuring that the hand soldering process is under control. The method most commonly used is to measure the idle tip temperature of the soldering station and to use this reading as a benchmark of system compliance. This method, although popular is now being seriously questioned by many industry professionals as being irrelevant in qualifying true system process control. This document aims to present a practical view of what factors are important for successful hand soldering and to suggest an alternative procedure for qualification that is simple, repeatable and directly related to the effectiveness of the soldering station.
Technical Library | 2010-06-17 20:48:04.0
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process.
Technical Library | 2021-06-15 15:11:43.0
Today's automated dispensing for electronics manufacturing is a complex and precise process in order to meet the challenges posed by ever more demanding assembly and component technology requirements. Dedicated dispenser technology is key to success in meeting challenging applications in a production environment with precision and repeatability. The major components that comprise a dispenser will be described, with a view toward understanding the importance of each; the result will illustrate how these sub-systems combine to create high-volume dispensing platforms. Real world examples with data substantiating the speed and accuracy obtained for some of the most common advanced dispensing applications in the market will be demonstrated such as high speed surface mount adhesive, wafer level Underfill and shield edge interconnects.
Technical Library | 2019-02-25 05:24:53.0
"The idea of the value chain is based on the process view of organizations, the idea of seeing a manufacturing (or service) organization as a system, made up of subsystems each with inputs, transformation processes and outputs".[1] The definition of a value-added chain by Michael E. Porter is one of many to be found in reference books, works and on websites. In principle, it involves a sequence of activities, executed by a manufacturing company to develop, produce, sell, ship, and maintain products or services. Three main parameters essentially influence a value-added chain: Direct activities − research, development, production, shipment etc. Indirect activities − maintenance, operation, occupational safety, environment etc. Quality assurance − monitoring, test/inspection; quality management etc. In particular, indirect activities and quality assurance generate a greater part of the costs in product manufacturing. This article principally focusses on the indirect activities, among them air purification.
Technical Library | 2016-01-21 16:52:27.0
Solder paste has long been viewed as "black magic". This "black magic" can easily be dispelled through a solder paste evaluation. Unfortunately, solder paste evaluation can be a challenge for electronic assemblers. Interrupting the production schedule to perform an evaluation is usually the first hurdle. Choosing the solder paste properties to test is simple, but testing for these properties can be difficult. Special equipment or materials may be required depending upon the tests that are chosen. Once the testing is complete, how does one make the decision to choose a solder paste? Is the decision based on gut feel or hard data?This paper presents a process for evaluating solder pastes using a variety of methods. These methods are quick to run and are challenging, revealing the strengths and weaknesses of solder pastes. Methods detailed in this paper include: print volume, stencil life, response to pause, open time, tack force over time, wetting, solder balling, graping, voiding, accelerated aging, and others.
Technical Library | 2021-07-28 18:35:13.0
The performance of electronic components is compromised by factors such as bubbles in the potting medium. Increasing numbers of applications – particularly in the automotive and electronics industries – therefore require completely bubble-free dispensing methods. This is where potting in a vacuum comes into focus. The widespread school of thought about this technology is that it is too complicated, too expensive and too slow. But a closer look shows that this view is incorrect. This is a mastered technology. As for costs, the calculation basis is key, since usually the potting and vacuum method is only considered after the required potting quality cannot be achieved reliably any other way. Under total cost of ownership assessments, higher system costs no longer play a key role, since component failure would result in much higher subsequent costs. And now there are proven solutions for high production volumes and/or shorter cycle times. This whitepaper explains when potting in a vacuum is ideal for your projects and what to be aware of.
