Technical Library: warp and management (Page 1 of 3)

Comparing Costs and ROI of AOI and AXI

Technical Library | 2013-08-07 21:52:15.0

PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen...

Teradyne

Flux Collection and Self-Clean Technique in Reflow Applications

Technical Library | 2008-05-14 15:44:58.0

This paper will review some basic past and present flux chemistries that affect flux collection methodology. It will also review some of the most common flux collection methods, self-cleaning techniques, and maintenance goals. And, finally, data will be presented from high volume production testing of an advanced flux management system.

Speedline Technologies, Inc.

Best Practices for Collecting Product Material and Compliance Data

Technical Library | 2017-02-23 17:23:16.0

Managing the environmental performance of products is an increasingly complicated challenge for manufacturers today. These companies face a complex tangle of requirements and mandates from regulators, consumers and customers to manage the toxicity, recycleability and overall environmental impact of their products. Not only have governments, business-to-business customers and consumers demonstrated a clear preference for better environmentally performing and "greener" brands, but investors are now pressuring manufacturers, as well. For example, the Dow Jones Sustainability Index identifies and tracks leading sustainability-driven companies around the world. This paper focuses on the challenges companies face and the best practices they can employ when collecting substance, material and compliance data from their suppliers and supply chain.

PTC

Sustainable Product Design and Supplier Material Disclosure

Technical Library | 2016-08-25 17:05:48.0

Sustainable product design and the task of bringing new, earth friendly products to market is a top priority for corporate leaders in the manufacturing industry. By not reaching their compliance and sustainability goals, manufacturers risk loss of market share, fines for non-compliance against regulatory directives and possible damage to their brand. Managing material disclosure information from the supply chain is one of their biggest challenges.

Siemens PLM Software

Make the Right Design Choices in Load Switching and Simulation in a High Current and Mechatronic Functional Test

Technical Library | 2016-02-04 19:11:47.0

In a typical mechatronic manufacturing functional test setup, actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. Each output is connected with different load and the test will either be sequential or concurrent. At lower power levels, these can usually be managed with general purpose switches. However, when it comes to higher power levels of currents more than 5 amps, such switching and loading might pose a greater challenge. Furthermore, critically in the manufacturing line, the tradeoff between cost and test time would have a great influence on the test strategy.This paper will present some key points to design a cost effective high power switching and load management solution.

Keysight Technologies

The Quality and Reliability of Intel's Quarter Micron Process

Technical Library | 1999-05-07 08:48:52.0

This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained. Four main reliability topics: ESD protection, electromigration, gate oxide wearout, and the modeling and management of mechanical stresses are discussed. Based on an analysis of the reliability implications of device scaling, we show how these four topics are of prime importance to component reliability...

Intel Corporation

Inline Wire and Cable Identification

Technical Library | 2013-01-30 14:02:44.0

Many OEM’s require that individual wires and cables used in their products be clearly identified with a mark or label. For some, such as in the military and aerospace markets, wire and cable identification (or “wire ID”) is mandatory and the process is governed by stringent specifications, such as SAE AS50881 (formerly MIL5088L). For others, the decision to use wire ID is a voluntary one. This article will describe what type of information is typically identified on wire and cables, concepts for improved productivity, what types of systems are available and the pros and cons of each.

Schleuniger, Inc.

COVID-19 - Managing Supply Chain Risk and Disruption

Technical Library | 2020-06-12 00:12:13.0

Responding to the immediate challenge While COVID-19 may be the catalyst for companies to revisit their global supply chain strategy and accelerate the adoption of Digital Supply Network models and capabilities, short-term actions need to be made to respond to the immediate challenge.

Deloitte

A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing

Technical Library | 2012-01-26 20:28:34.0

In electronics design, Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet, a part has a third view, which CAD tools ignore – its supply data (Manufacturer part num

UCLA - Networked & Embedded Systems Laboratory

Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes

Technical Library | 2009-10-29 11:45:52.0

The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to reduce production costs whilst maintaining a consistently high quality level of the manufactured products. Manual repair soldering that is expensive, time-consuming and cost intensive is already unacceptable due to the required quality and the reproducibility of the whole manufacturing process.

SEHO Systems GmbH


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