Technical Library | 2023-09-16 06:12:26.0
Discover our cost-effective wave soldering machine designed to streamline your PCB assembly process without breaking the bank. Achieve quality soldering with affordability.
Technical Library | 2023-09-13 12:46:41.0
Online PCBA cleaning machines are a great way to improve the quality and reliability of your printed circuit boards (PCBs). These machines use a variety of methods to remove contaminants and debris from PCBs, including water, solvents, and ultrasonic waves.
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2009-02-13 12:29:39.0
To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering
Technical Library | 2008-02-12 22:52:41.0
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems.
Technical Library | 2004-09-02 11:56:32.0
The main goal of this paper is to highlight the importance of interrelating the physics and the chemistry in wave soldering and soft soldering in general. Often we find the disciplines of chemistry and physics being analyzed distinct and separate. However in the quest for alternative ways for leading edge competitive and especially environmental friendly manufacturing, separating or ignoring this interrelationship is detrimental to the success of No-Residue soldering.
Technical Library | 2013-09-05 17:44:14.0
Surface plasmon polaritons (SPPs) are localized surface electromagnetic waves that propagate along the interface between a metal and a dielectric. Owing to their inherent subwavelength confinement, SPPs have a strong potential to become building blocks of a type of photonic circuitry built up on 2D metal surfaces; however, SPPs are difficult to control on curved surfaces conformably and flexibly to produce advanced functional devices. Here we propose the concept of conformal surface plasmons (CSPs), surface plasmon waves that can propagate on ultrathin and flexible films to long distances in a wide broadband range from microwave to mid-infrared frequencies.
Technical Library | 2017-12-11 22:31:06.0
Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.
Technical Library | 2020-08-13 00:59:03.0
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime. The nature of additive manufacturing allows designers to create custom components and devices for specialized applications and provides an excellent and inexpensive way of prototyping electronic designs. The combination of multiple printable materials enables the vertical integration of conductive, dielectric, and semi-conductive materials which are the fundamental components of passive and active circuit elements such as inductors, capacitors, diodes, and transistors. Also, the on-demand manner of printing can eliminate the use of subtractive fabrication processes, which are necessary for conventional microfabrication processes such as photolithography, and drastically reduce the cost and material waste of fabrication.
Technical Library | 2007-11-15 15:54:44.0
At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes.
