Technical Library | 2023-09-16 03:40:41.0
Wave soldering machines are the most efficient way to solder PCBs. They are used to solder components to a PCB by passing the PCB through a wave of molten solder. This process is fast, accurate, and repeatable, making it ideal for mass production. In this article, we will discuss the basics of wave soldering machines, including their components, operation, and benefits. We will also provide a buying guide to help you choose the right wave soldering machine for your needs.
Technical Library | 2024-02-26 09:08:23.0
Precision Control in Electronic Assembly: Selective Wave Soldering Machine Discover the technical features of I.C.T's Selective Wave Soldering Machines, including precision flux application and innovative preheating systems. Learn how these machines redefine efficiency and reliability in electronic assembly. Introduction: Enhancing Precision Soldering: Technical Features of Selective Wave Soldering Machines by I.C.T Explore the innovative design and operation of I.C.T's Selective Wave Soldering Machines, featuring a seamless PCB handling system and modular design for enhanced assembly line flexibility. Experience precision control and efficiency with comprehensive PC controls, allowing easy adjustment of solder parameters like temperature and flux type. Automatic calibration and CCD mark positioning ensure consistent soldering quality. Detail Excellence: Enhancing Selective Wave Soldering Technology Flux System Mastery German high-frequency pulse injection valve ensures precise flux application. Optional flux nozzle jam detection simplifies maintenance. Pressure tank and precision pressure flow meter ensure consistent flux control. Preheat System Excellence Bottom IR preheating system ensures stability and efficiency. Maintenance is simplified with a tool-free mode and plug-in design. Soldering System Innovation Swedish "PRECIMETER" electromagnetic pump coil ensures stability. Stainless steel soldering pot prevents tin liquid leakage. N2 online heating system reduces solder dross. Transmission System Mastery Specially designed material profiles ensure operational stability. Thickened customized rails guarantee flawless operation. Control and Intelligence Keyence PLC+module high-end bus control system ensures stability. Industry 4.0 compliance allows guided programming and real-time data visualization. Market Promotion and Success Stories: Elevating Selective Wave Soldering Machine I.C.T's strategic market positioning has led to global success across diverse industries. Success stories from European clients highlight reliability and trust in the machine. Over 70 units sold across 20+ countries since 2022, establishing its industry-leading position. Conclusion Conclusion: I.C.T's Selective Wave Soldering Machine combines technical excellence with global market success, solidifying its leadership in precision soldering technology.
Technical Library | 2009-01-15 00:42:58.0
Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.
Technical Library | 2015-04-29 03:48:39.0
SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process 3D inspection on the assembly line. SPI systems measure the height and volume of the solder pads before the components are applied and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to the SPI measurement is the accuracy of the height measurement because that has a direct correlation with solder volume and defects.
Technical Library | 2019-01-09 19:19:52.0
The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated soldering or rework operations, users may work with Sn-Ag-Cu or Sn-Cu based alloys. One of the challenges with these types of lead-free alloys for automated / hand soldering operations, is that the life of the soldering iron tips will shorten drastically using lead-free solders with an increased cost of soldering iron tool maintenance/ tip replacement. Development was done on a new lead-free low silver solder rework alloy (Sn-0.3Ag-0.7Cu-0.04Co) in comparison with a number of alternative lead-free alloys including Sn-0.3Ag-0.7Cu, Sn-0.7Cu and Sn-3.0Ag-0.5Cu and tin-lead Sn40Pb solder in soldering evaluations.
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