Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2024-02-26 09:08:23.0
Precision Control in Electronic Assembly: Selective Wave Soldering Machine Discover the technical features of I.C.T's Selective Wave Soldering Machines, including precision flux application and innovative preheating systems. Learn how these machines redefine efficiency and reliability in electronic assembly. Introduction: Enhancing Precision Soldering: Technical Features of Selective Wave Soldering Machines by I.C.T Explore the innovative design and operation of I.C.T's Selective Wave Soldering Machines, featuring a seamless PCB handling system and modular design for enhanced assembly line flexibility. Experience precision control and efficiency with comprehensive PC controls, allowing easy adjustment of solder parameters like temperature and flux type. Automatic calibration and CCD mark positioning ensure consistent soldering quality. Detail Excellence: Enhancing Selective Wave Soldering Technology Flux System Mastery German high-frequency pulse injection valve ensures precise flux application. Optional flux nozzle jam detection simplifies maintenance. Pressure tank and precision pressure flow meter ensure consistent flux control. Preheat System Excellence Bottom IR preheating system ensures stability and efficiency. Maintenance is simplified with a tool-free mode and plug-in design. Soldering System Innovation Swedish "PRECIMETER" electromagnetic pump coil ensures stability. Stainless steel soldering pot prevents tin liquid leakage. N2 online heating system reduces solder dross. Transmission System Mastery Specially designed material profiles ensure operational stability. Thickened customized rails guarantee flawless operation. Control and Intelligence Keyence PLC+module high-end bus control system ensures stability. Industry 4.0 compliance allows guided programming and real-time data visualization. Market Promotion and Success Stories: Elevating Selective Wave Soldering Machine I.C.T's strategic market positioning has led to global success across diverse industries. Success stories from European clients highlight reliability and trust in the machine. Over 70 units sold across 20+ countries since 2022, establishing its industry-leading position. Conclusion Conclusion: I.C.T's Selective Wave Soldering Machine combines technical excellence with global market success, solidifying its leadership in precision soldering technology.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
Technical Library | 2006-12-18 14:55:35.0
Many solder users have preconceived notions and worries involving reflow profiling guidelines. Year after year of reading profiling recommendations in industry publications, from a litany of pundits, has made it clear that perfect profiles exist and should be sought after. They feel if the solder supplier gives them a tidy drawing on a piece of paper with times and temperatures that it will magically solve all their reflow problems. This is, unfortunately, an often incorrect assumption.
Technical Library | 1999-06-23 20:29:21.0
This paper outlines the harmful effects of out-of-control process parameters and describes methods of measuring and tracking them to keep them in control. It addresses all critical variables of wave soldering: flux deposition, preheat application, conveyor speed, solder temperature and solder contact time.
Technical Library | 2009-12-23 16:55:08.0
Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ever. In each chamber or zone, air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a cyclone around the board. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This technology is ideal for the precise profiles needed for lead free soldering.
Technical Library | 2007-12-20 16:28:08.0
Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often associated with profiling can be reduced if there is a strong understanding of the variables that can be encountered during the reflow process, as well as the metallurgical dynamics of the soldering process. This paper shall provide a brief outline of the reflow profile in general, with specific emphasis placed upon the suggested time spent above the melting temperature of the solder. The guidelines for soldering to various surfaces and with alternative solder alloys also are discussed.
Technical Library | 2009-04-22 21:13:19.0
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.
