Technical Library | 2015-02-12 13:32:52.0
Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders for PCB assembly and rework. This approach creates challenges because of the relatively high temperatures needed for lead-free soldering. Additionally, lead-free solder alloys typically do not wet or wick as easily as Sn63Pb37 leaded types. As PCBs often include both BGAs and simpler discrete devices, a lead-free rework capability should include a suitable soldering station and a BGA rework station. This article shows how such equipment can be adapted to overcome the lead-free issues and provide a successful reworking facility.
Technical Library | 2017-08-25 14:48:39.0
High Quality Solutions to Reduce Manufacturing Costs and Time
Technical Library | 1999-08-05 09:34:44.0
This document demonstrates a sequential process of evaluating automated wafer instruments and discusses why this approach is useful for studying instruments that have automation features such as loading and focusing mechanisms. The methodology specifies a series of experiments consisting of two or more capability studies followed by a stability study. Each experiment achieves a separate goal, yet combines with the others in providing information needed to assess the usefulness of the instrument.
Technical Library | 2023-11-14 19:42:24.0
Selective soldering is not a new process. It is already exists and used 30 years ago for through-hole component by different industries for automotive and medical products. Now most manufacturing industries are moving forward on SMD's miniaturization to reduce PCB complexity and balance component density on the board to ensure a good assembling process. By this concept, why selective soldering still utilized and used? Does it because of component reliability, uniqueness or complexity having this in mind next question will be which platform will best fit for the product
Technical Library | 2009-10-22 02:38:13.0
An electronic product's reliability has the potential to make or break its manufacturer and can be life-threatening in many safety critical applications. Conformal coatings have long been used to protect electronic assemblies from their operating environment but can vary hugely in their protective performance. It is the objective of this article to explain in detail why it is important to qualify coating products to the relevant standards and how different coating types affect performance.
Technical Library | 2015-08-18 17:48:53.0
Why Selectively Conformal Coat the Electronic Assembly? Printed circuit boards (PCBs) are employed in a variety of products and devices, and this means that it might be necessary for your PCBs to be moisture resistant. It is important to choose the right type of conformal coating so you need not worry about the durability of your product. Fortunately, there are several options available that can help, and you can even use selective conformal coating robots to provide proper application of the coating.
Technical Library | 2022-09-29 14:08:42.0
Electronic vehicles, devices and components must not overheat, otherwise they may fail to operate correctly. Thermal management is a major technical challenge as components are getting smaller, power densities are increasing and demands on robustness and reliability are becoming more stringent. To prevent power losses or defects resulting from overheating, liquid thermal interface materials (TIMs) are being increasingly used to dissipate their heat. This White Paper discusses the aspects that need to be taken into account when dispensing these mostly highly viscous, highly abrasive materials and why in many cases they are better alternatives to pads, tapes and foils.
Technical Library | 2013-08-07 21:52:15.0
PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen...
Technical Library | 2013-08-13 09:49:53.0
One of the common issues I’ve noticed when visiting shops that use crimp force monitors (CFMs) is that the CFMs are usually turned off, regardless of the brand, because engineers and operators are not using them properly. Why, with all of their benefits, are CFMs not being used regularly by employees? One of the biggest problems is the lack of understanding of the variables affecting the CFM’s ability to detect variations. Crimp quality detection is similar to baking a cake. There are a lot of ingredients and if one ingredient is missing or of bad quality, you likely are not going to achieve your desired result. This article will go back through the basics of a crimp quality detection system and discuss what ingredients or variables you need to consider before switching off that CFM.
Technical Library | 2020-02-14 14:43:21.0
To meet the steady increase in technical requirements for electronic components, potting media properties must be extremely precise. Rheology, viscosity, filler content and curing behavior are only a few of the factors that play a role in their practical use. However, the growing complexity of materials often negatively impacts the ability to process or dispense them. In this case, material preparation and feeding systems specially designed for this purpose are required. These systems optimally prepare the material for the actual application and ensure homogeneous feeding to the dispensing system.
