Technical Library | 2010-06-23 21:59:03.0
Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area.
Technical Library | 2017-12-21 11:24:05.0
The present work concerns on the use of sensors to monitor the structural health of wind turbine . Conventionally the inspection was made using non-contact sensing during the turbine’s inoperable period hence loss occurred. A real -time monitoring system via embedded wireless sensor is preferred but the sensor could only be implanted using non-contact printing method due to most turbine blade s’ curved surface. Conductive ink associate d with non-contact printing method via fluid dispensing system are proposed since conductive inks are proven stretchable and fluid dispensing system enables printing on various substrates and works well with any materials...
Technical Library | 2020-05-26 22:28:56.0
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os.
Technical Library | 2022-06-27 16:50:26.0
Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.
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