Technical Library: wires (Page 2 of 7)

Design and Construction Affects on PWB Reliability

Technical Library | 2012-04-26 18:52:37.0

First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva

PWB Interconnect Solutions Inc.

Moisture Absorption Properties of Laminates Used in Chip Packaging Applications

Technical Library | 2020-11-29 22:06:45.0

Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.

Isola Group

Failure Modes in Wire bonded and Flip Chip Packages

Technical Library | 2014-12-11 18:00:09.0

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared

Peregrine Semiconductor

An Investigation of Whisker Growth on Tin Coated Wire and Braid

Technical Library | 2012-08-02 21:05:14.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o

Rockwell Collins

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

Technical Library | 2012-08-23 21:06:35.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res

Albemarle Corporation

Looking Forward - The Benefits of Networking your Wire Processing Equipment

Technical Library | 2013-10-21 08:53:36.0

Having been in the wire processing business for 30 years, I have seen a lot of changes and improvements made possible, primarily by advances in electronics and software. Looking ahead, I see continued improvements in efficiency through networking technology.

Schleuniger, Inc.

The Conditions and Solutions of Lead-free Hand Soldering

Technical Library | 2013-01-05 22:21:01.0

More and more countries legislate to forbib lead usage in solder material. However, the lead-free solder wire has higher melting point and soldering temperature, increase soldering iron temperature may damage the PCB or components. How to solve this problem?

Leisto Industrial Co., Limited

Tin Whisker Risk Management by Conformal Coating

Technical Library | 2015-10-22 17:37:28.0

The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic, polyurethane and parylene. Also included in this paper are tin whisker inspection results of tin-plated braiding and wire that was exposed to an environment of 50°C with 50% relative humidity for over five years.

Lockheed Martin Corporation

PWB Manufacturing Variability Effects on High Speed SerDes Links: Statistical Insights from Thousands of 4-Port SParameter Measurements

Technical Library | 2010-08-05 18:39:39.0

Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI me

i3 Electronics

Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold

Technical Library | 2023-01-10 20:08:36.0

Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly.

Uyemura International Corporation


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