Technical Library: worked (Page 3 of 13)

Test Solution for Heatsinks in Power Electronics Applications

Technical Library | 2021-03-24 01:30:47.0

Power electronics technology is widely used in several areas, such as in the railways, automotive, electric vehicles, and renewable energy sectors. Some of these applications are safety critical, e.g., in the automotive domain. The heat produced by power devices must be efficiently dissipated to allow them to work within their operational thermal limits. Moreover ...

Politecnico di Torino

A Flexible Front-End for Wearable Electrochemical Sensing

Technical Library | 2022-01-19 17:06:16.0

This work presents the design and the realization of a flexible front-end circuitry for electrochemical sensing with wearable devices. The hardware combines readout circuitry for amperometric and Open Circuit Potential (OCP) measurements. The sensing platforms are dedicated to lactate and lithium detection in sweat, hence allowing the monitoring of athletes under physical effort.

Swiss Federal Institute of Technology Lausanne - Integrated Systems Laboratory (Laboratoire des Systèmes Intégrés – LSI)

Looking Forward - Manufacturing Execution Systems for SME’s

Technical Library | 2015-12-14 13:40:04.0

A Manufacturing Execution System (MES) is a software program that manages and monitors production work in a factory. The MES controls and monitors all manufacturing data in real time, so there is no guesswork as to the status of any given job, machine, operator, etc. The focus is on short-interval scheduling (shift or day) with an emphasis on optimizing the distribution of work orders. Larger manufacturers have employed MES’s for years but many small to medium sized enterprises (SME’s) have yet to adopt such systems. The benefits of using an MES are many. Looking forward, I predict that even the smallest manufacturing companies will employ MES systems in the future.

Schleuniger, Inc.

Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven

Technical Library | 2017-12-21 11:24:05.0

The present work concerns on the use of sensors to monitor the structural health of wind turbine . Conventionally the inspection was made using non-contact sensing during the turbine’s inoperable period hence loss occurred. A real -time monitoring system via embedded wireless sensor is preferred but the sensor could only be implanted using non-contact printing method due to most turbine blade s’ curved surface. Conductive ink associate d with non-contact printing method via fluid dispensing system are proposed since conductive inks are proven stretchable and fluid dispensing system enables printing on various substrates and works well with any materials...

University of Tun Hussein Onn

Database Driven Multi Media Work Instructions

Technical Library | 2019-03-25 12:45:56.0

Work instructions are time consuming to generate for engineers, often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail, with varying guidelines, for multiple stations, operators and lines. Minor component, station or process changes – down to the modification of an individual BOM component – can cause headaches when attempting to maintain consistency across multiple work instructions that are touched by the change.The solution presented here improves efficiency and saves engineering time by making use of a database driven approach. Manufacturing details, component information, process guidelines, annotations, machine-specific data, and more can be stored in one central database. Any information stored in this single repository can then be modified quickly in one location and automatically propagate seamlessly throughout multiple work instructions. These can be instantly printed out or displayed on screens at appropriately affected stations with the simple click of a button, as opposed to regenerating from scratch, or going in and reviewing many documents to find and update with the change.

Optimal Electronics Corporation

Pad Cratering Susceptibility Testing with Acoustic Emission

Technical Library | 2015-08-13 15:52:40.0

Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.

Agilent Technologies, Inc.

Package-on-Package (PoP) Warpage Characteristic and Requirement

Technical Library | 2021-12-16 01:48:41.0

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.

Intel Corporation

Effect Of Voids On Thermo-Mechanical Reliability of Solder Joints

Technical Library | 2019-10-16 23:18:15.0

Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.

Alpha Assembly Solutions

Different Types of Pressure Transmitters, Working Principle, and How to Select Pressure Transmitter

Technical Library | 2021-11-25 01:24:20.0

Pressure transmitter is a kind of pressure measuring instrument widely used in many transmitters. It is widely used in petroleum, chemical, metallurgy, food, electric power, medicine, papermaking, textile and other industries. It is mainly used to detect the differential pressure, pressure, absolute pressure and liquid level of fluid.

OKmarts Industrial Parts Mall

The Foundation of the Silicon Age

Technical Library | 1999-05-06 13:35:26.0

The invention of the transistor almost fifty years ago was one of the most important technical developments of this century. It has had profound impact on the way we live and the way we work. This paper describes the events that led to the invention of the point-contact transistor in December of 1947. It continues with the development of the theory of the junction transistor in early 1948 and the fabrication of the first grown-junction transistor in 1950.

Alcatel-Lucent


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