Technical Library | 2013-01-24 20:15:46.0
Being found in the search engines for a wide variety of terms directly related to my business would be my 1st priority...
Technical Library | 2019-10-18 10:37:25.0
It usually does not make any logic to invest in costly fabrication equipment in case you just desire to spin some prototypes and rather outsource your Printed Circuit Board assembly as well as prototype fabrication to a trustworthy vendor. I would provide a few tips as to what to consider when seeking a contract manufacturer. The two most common procedures associated with Printed Circuit Board Assembly are through-hole technology and surface mount technology. Talking about the difference between through-hole technology and surface mount technology. Through-hole elements have metal leads, & these metal leads are supplied through-plated holes inside the circuit board. On the other hand, SMT elements might or might not have leads, nevertheless most significantly, they are developed to be soldered onto the surface of the circuit boards straight on the same side as the element body. A lot of contract manufacturers would provide a quick quote mechanism over their site for the fabrication of circuit boards as well as assembly of prototypes. This would bank your time when comparing various vendors. Ensure that the quote system facilitates you to fill your details, for instance, board material, thickness, copper thickness, milling, etc. in order that you can avail of a precise quote devoid of any surprises afterward. And this is quite necessary. Typically the cost per board would decline as quality upgrades. This is owing to the fairly high setup price of circuit board fabrication over and above component assembly. A few vendors would employ a system where they unite boards from various consumers. This manner the setup price would be circulated among numerous clients. When you fabricate an item, you clearly don’t desire to have to fabricate a big quantity of boards straight away whilst you improve your design. One restriction with small quantity prototypes though is that the option of materials & material thicknesses would be constrained. In case you are employing a particular material then opportunities are there will not be any other clients employing the same material. Additionally, lead time plays a major role in indecisive prices. A longer lead time facilitates the fabricator more liberty in slotting your fabrication. This is basically reflected in cheaper prices that would view in the quote section. Clearly, if you are in a hurry and desire to be moved to the summit of the pile you would require splurging more dollars. Ensure that your contract fabricator would support the file sort for producing which you offer. The most general format for printed circuit board fabrication is the Gerber format nonetheless a few vendors would moreover embrace board files from general printed circuit board software products. A few suppliers also provide in house printed circuit design. Even in case, you create your board yourself, choosing a vendor with design services might prove resourceful in case there is an issue with your files. In this scenario, your vendor could make swift changes that would neglect pricey delays. If you are looking for an Electronic Manufacturing Services (EMS Assembly) provider, then the web is the best to search.
Technical Library | 2015-01-12 09:27:49.0
V2V is a collision avoidance technology that transmits data between vehicles to help warn drivers of potential crashes. This technology would improve safety by allowing vehicles to communicate with each other and exchange basic safety data, such as position and speed and warn the driver of potentially dangerous situations.
Technical Library | 1999-04-26 15:51:30.0
The goal of the flux evaluation was to identify one product that would meet the needs of all SICN's wave solder products and processes while producing high quality assemblies. At the outset of the evaluation, it was unclear whether a single flux chemistry could satisfy such a broad range of demands, particularly because SICN's utilization of less aggressive, low-impact chemicals.
Technical Library | 1999-05-06 13:41:18.0
Invented in 1971, the microprocessor evolved from the inventions of the transistor (1947) and the integrated circuit (1958). Essentially a computer on a chip, it is the most advanced application of the transistor. The influence of the microprocessor today is well known, but in 1971 the effect the microprocessor would have on everyday life was a vision beyond even those who created it. This paper presents the history of the microprocessor in the context of the technology and applications that drove its continued advancements.
Technical Library | 2007-05-30 19:30:22.0
Transition to lead-free is accelerating and when considering constraints related to lead-free and conventional solder pastes, one concern is rising: flexibility. It would be dangerous to commit to lead-free only while the technology is not yet stabilized. Manufacturers need to consider all of the issues related to lead-free and need to find flexible equipment which are able to adapt to both conventional and lead-free constraints.
Technical Library | 2008-09-04 17:57:24.0
In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB.
Technical Library | 2008-11-20 00:46:10.0
The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.
Technical Library | 2011-09-01 18:11:31.0
Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it, the objective is the same, namely the clean up of remaining solder after a component (particularly a BGA) or R.F. Shield has been removed from a PCB. This paper will describe the various methods that are available and discuss their pros and cons.
Technical Library | 2020-01-01 17:06:52.0
The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating.
