Technical Library | 2022-03-21 19:00:07.0
X-ray fluorescence (XRF): a non-destructive analytical technique used to determine the chemical composition of materials XRF occurs when a fluorescent (or secondary) X-ray is emitted from a sample that is being excited by a primary X-ray source. Because this fluorescence is unique to the elemental composition of the sample, XRF is an excellent technology for qualitative and quantitative analysis of the material composition. XRF spectrometry has a broad range of applications in industry, which we will discuss later in this ebook.
Technical Library | 2023-12-26 17:50:54.0
In this white paper, we discuss the pros and cons of five analytical techniques when applied to residue analysis on electronic assemblies. We evaluate the following for their application and limitations for analyzing both visible and invisible residues: FITR, SEM/EDX, XRF, Ion Chromatography, and ROSE
Technical Library | 2022-10-04 16:43:10.0
In this paper I will discuss the different methods and equipment used to detect counterfeit electronic parts, specifically integrated circuits as well as demonstrate some of the "red flags" that help to identify a part as being suspected counterfeit. We will begin with the initial receipt of the parts and the examination of the outer packaging, the basic visual inspection of the parts, the visual inspection and documentation at high magnification, permanency marking, blacktop test, scrape test, XRF (RoHS), decapsulation, X-ray, basic electrical testing, C-SAM, full function testing and limited function testing.
Technical Library | 2008-08-14 20:48:12.0
The Restriction of Hazardous Substances (RoHS) regulations of the European Union, and similar regulations being enacted around the world, require the virtual elimination of lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6), polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) from electronic products. Allowable concentration levels in any homogeneous material contained within a product are extremely low: 0.01% for Cd and 0.1% for other substances by weight. The most significant issue affecting the practical validation of RoHS compliance in the day-to-day assembly environment is ensuring that no restricted substances, especially tin-lead (SnPb) materials, have inadvertently entered into the production stream.
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