Used SMT Equipment | SMT Equipment
Product Name: FX-3 JUKI chip mounter Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip (90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (or diagonal Lon
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter CM602-L Product number: CM602-L Detailed product introduction Substrate size: L50 mm x W50 mm ~L510 mm W460 mm x High speed mounting head: 12 suction nozzle (ceramic) (white) Mounting speed: 0.036
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter CM602-L Product number: CM602-L Detailed product introduction Substrate size: L50 mm x W50 mm ~L510 mm W460 mm x High speed mounting head: 12 suction nozzle (ceramic) (white) Mounting speed: 0.036
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter CM602-L Product number: CM602-L Detailed product introduction Substrate size: L50 mm x W50 mm ~L510 mm W460 mm x High speed mounting head: 12 suction nozzle (ceramic) (white) Mounting speed: 0.036
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter CM602-L Product number: CM602-L Detailed product introduction Substrate size: L50 mm x W50 mm ~L510 mm W460 mm x High speed mounting head: 12 suction nozzle (ceramic) (white) Mounting speed: 0.036
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 (optimum condition) IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ~□33.5mm (or dia
Used SMT Equipment | Flexible Mounters
Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo
Used SMT Equipment | SMT Equipment
Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo
Used SMT Equipment | Chipshooters / Chip Mounters
Model :FX-2/FX-2C SMT MACHINE Placement speed:Chips:40000CPH*2(0.09sec/chip) Component mount range:0402 chips ~33.5mm Station:80 Power supply:3-phase AC200~415V 4KVA/12KVA Size:1880*1731*1490mm Weight:2100kg Currently, all the machines
Used SMT Equipment | Chipshooters / Chip Mounters
JUKI FX-3 Pick and Place machine Specification Substrate dimension: L- substrate-(410×360mm) L-wide substrate-(510×360mm)*1 XL substrate-(610×560mm) Component Height:6mm size Component range : laser discrimination radar system,0402(British 01005) ~