Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Used SMT Equipment | Pick and Place/Feeders
Make: FUJIModel: FUJI AIMEXIIIC Details:1.Mounting Range: 0402(in 01005)-25x20mm, capable of mounting BGA (optional).2.Mounting Speed: 0.165 seconds per chip, up to 21,800 chips per hour.3.Mounting Accuracy: ±0.05mm.4.Applicable PCB Size: Max 457x35
Used SMT Equipment | SPI / Solder Paste Inspection
3D SPI system inline 3 D camera min. paste size 150x150µm max. paste size 20x20mm max. paste hight 1000µm min. PCB size 50x50mm max. PCB size 500x510m PCB thickness 0,4mm - 4mm measurements 1060mm (width) x 1285mm (length) x 1400mm (hight) weight 10
Used SMT Equipment | SPI / Solder Paste Inspection
Agilent SP50 Series II 3D SPI 3D Solder Paste Inspection System Model: SP50 Series II Vintage: 2006 Maximum board size: 510 by 510 mm (20 by 20 in) Minimum board size: 50 by 50 mm (1.97 by 1.97 in) Maximum board thickness: 4 mm (0.16 in) 2D an
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE350-L 3D SPI 3-D Solder Paste Inspection Machine Model: SE350-L Vintage: 2010 OS: Windows XP Calibration Kit & Manuals Included Calibration-Free Sensor Technology Integrated SE500 Sensor Assembly Inspecs Pad Sizes Down To 01
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Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE300 (2004) Solder Paste Inspection Brand: Cyberoptics Model: SE300 Description: Solder Paste Inspection Serial: 10239 Year: 2004 Details: • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max pad size
Used SMT Equipment | SPI / Solder Paste Inspection
Koh Young 3D KY8030-L Solder Paste Inspection Machine (2008) Brand: Koh Young 3D SPI Model: KY8030-L Year: 2008 Serial #: SPI-8L110 Machine Size: Large Max Panel Dimensions: 510mm x 510mm &n
Used SMT Equipment | AOI / Automated Optical Inspection
Inspects down to 0402 for parts/solder checks Fine pitch QFP's and TSOPS Board Size: 2.5" x 2.5" Minimum / 12" x 12" maximum Capable of checking for missing part, solder quality, electrode lead co
Used SMT Equipment | AOI / Automated Optical Inspection
Large PCB manual included center board supports and J-Lead options Hardware Specifications Image Signal Input Unit * Video Camera: Triple Element CCD Camera * Light Source: 3-Ring-Shaped Fluorescent Lamps with automatic brightness control
