Used SMT Equipment | General Purpose Test & Measurement
The details for this item are included in the November 7-9 Online Auction. Please visit the following website for all of the details. http://bajabid.com/online-smt-auction/
Used SMT Equipment | In-Circuit Testers
This machine is included in the February 26 - March 2, 2018 Online Auction. Please visit the below website for all of the details on this machine. http://bajabid.hibid.com/catalog/123298/february-2018-online-auction/?tab=0
Used SMT Equipment | Semiconductor & Solar
Yamaha YS24 SMT mahcine Model YS24: (Note: high-speed machine) Object substrate: L50 x W50mm to L700 x W460mm Mount capacity: 72,000CPH (0.05s /CHIP: our best condition) Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ)
Used SMT Equipment | SMT Equipment
Product name:KD - 770 JUKI chip mounter Product number: KD - 770 if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype
Used SMT Equipment | SMT Equipment
Product name: JUKI - JX350 Product number: JUKI - JX350 Product details, JUKI JX - 350 long base board high-speed chip mounter Features: Chip components 32000 CPH (best conditions) Element size Laser recognition: 0603 ~ 33.5 mm square ele
Used SMT Equipment | Semiconductor & Solar
V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
Y100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate thickness: 0.4 to 3.0 substratetransfer direction
Used SMT Equipment | Semiconductor & Solar
Model YV100II SMT speed :0.25 SEC /CHIP high speed mount Substrate size: L600*W400(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 Mounting accuracy ± 0.1mm/CHIP ±0.08/QFP Power three-phase AC220/208/230/240/380/400/416 v + / - 10%,