Used SMT Equipment | Pick and Place/Feeders
Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip(90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (ordiagonal Long 47m) Feeder number: up to 120 (using
Used SMT Equipment | Flexible Mounters
Product Name: FX-3 JUKI chip mounter Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip (90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (or diagonal Lon
Used SMT Equipment | SMT Equipment
Product Name: FX-3 JUKI chip mounter Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip (90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (or diagonal Lon
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 2080 JUKI high-speed chipmounter Product number: KE - 2080 Detailed product introduction Characteristic： Small components of high speed SMT capacityand IC or complex shape abnormity components of high precision SMT ability andg
Used SMT Equipment | SMT Equipment
Product name: KE - 2080 high-speed chip mounter Product number: KE - 2080 Detailed product introduction Characteristic： Small components of high speed SMT capacity and IC or complex shape abnormity components of high precision SMT ability and g
Used SMT Equipment | SMT Equipment
Product Name: FX-3 JUKI chip mounter Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip (90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (or diagonal Lon
Used SMT Equipment | SMT Equipment
Product name: KE - 2080 high-speed chip mounter Product number: KE - 2080 Detailed product introduction Characteristic： Small components of high speed SMT capacity and IC or complex shape abnormity components of high precision SMT ability and g
Used SMT Equipment | Pick and Place/Feeders
Type name high-speed veneer KE-2070M / KE -2070L / KE -2070E Substrate size M substrate(330 X 250mm) ○ L substrate(410 X 360mm) ○ E substrate(510 X 460mm) ○ Component height 6mm specification ○ 12Mm specification ○ 20Mm specification _ 25Mm sp
Used SMT Equipment | Screen Printers
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Used SMT Equipment | Adhesive Dispensers
YAMAHA placement machine YV100X type substrate size: 1, M-Type: L460 * W335 ~ L50xW50mm / t = 0.4 ~ 3.0mm 2, L-Type: L460 * W440 ~ L50xW50mm / t = 0.4 ~ 3.0mm 3, ※ATS20A use: L460*W250～L50xW50mm Second, YAMAHA placement machine YV100X productio
winsouce.jpg)