Used SMT Equipment | Stencil Cleaners
SmartSonic Ultrasonic Stencil Wash • Model: 529 • Year: 2018 • Enviroguard-P Filtration System • Hand-Held Spray Rinse • Hand-Held Air Blow-Off • Footprint: 21.8" x 35.5" x 31"H • Wash Tank Dim
Used SMT Equipment | Pick and Place/Feeders
Yamaha Mounter YSM10 basic specifications: 1. Target board size: L510 x W460 mm ~ L50 x W50 mm. Use optional accessories, can correspond to L610mm substrate 2, placement capacity: HM placement head (10 nozzles) specifications HM5 placement he
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Used SMT Equipment | Stencil Cleaners
Smart Sonic 1550 Ultrasonic Stencil / Pallet Cleaner Includes: EnviroGuard-STD Closed Loop System Vintage: 2014 Lightly Used – Prototype Lab Use Stainless Steel Construction Cleans up to 29” x 29” stencils 2 minute cleaning cy
Used SMT Equipment | Soldering - Wave
- Machine is available at any time, - Foam fluxer, - Single wave (laminar), - 3pcs of frame included, - Working condition. - YOM - 1995. It is filled with SN100C (106 kg) and we can provide report of test on the purity of the alloy. Equipmen
Used SMT Equipment | Soldering - Wave
Working width: 330 mm (13") Solder module: Type: lead-free double wave solder module Solder volume: approx. 390 kg (860 lb.) LEADFREE approx. 335 kg (739 lb.) lead-free alloy Warm-up time: approx. 2.5 h Preheating length: 1,100 mm (43.3") Fl
| 1 |
