Used SMT Equipment | Flexible Mounters
Product Name: Samsung CP45FV multi-function chip mounter Product number: CP45FV Detailed product introduction Samsung CP45FV multi function placement: Mounting head: 6 mounting head Servo system: servo motor drive X, Y shaft - Z axis shift drive
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV multi-function chip mounter Product number: CP45FV Detailed product introduction Samsung CP45FV multi function placement: Mounting head: 6 mounting head Servo system: servo motor drive X, Y shaft - Z axis shift drive
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV multi-function chip mounter Product number: CP45FV Detailed product introduction Samsung CP45FV multi function placement: Mounting head: 6 mounting head Servo system: servo motor drive X, Y shaft - Z axis shift drive
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
Used SMT Equipment | Pick and Place/Feeders
Manncorp MC385V2-V Pick and Place Vintage: 2014 Details: Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 CPH
Used SMT Equipment | Pick and Place/Feeders
Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | Repair/Rework
BGA 3101: Control Box BGA 3591:Main system CPU, monitor, keyboard, mouse, etc. Manual Nozzles and spares This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional eith
