Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Used SMT Equipment | General Purpose Equipment
ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa
Used SMT Equipment | X-Ray Inspection
Very Nice Nicolet Xray Machine For Sale The system is complete and in good working condition See attached pictures and information below Nicolet Imaging Systems Model Number: NXR-1500 Serial Number: 0150011 Year 2000 Variable Speed Joystick
Used SMT Equipment | Pick and Place/Feeders
Universal Instruments Polaris Machine For Sale Very clean and in Good Condition See attached pictures and information below Polaris Model Number: 7514A Equipment Number: 10076306 Year 2008 Travel: 550 mm x 800mm Repeatability: +/- 0.01
Used SMT Equipment | SMT Equipment
ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Used SMT Equipment | THT Equipment
For sale great shape Automated Global Production Device Redial Lead Thru-hole lead component former. This machine is still supported by GPD and can b bought new. See links below. Contrary to popular belief, thru-hole technology is actually thriving
