Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Model Specification : Model FUJI NXTII Board size: M3II/M6II Single track: 48mm x 48mm - 610mm x 534mm M3II/M6II Double track :48mm x 48mm - 510mm x 534mm M6IISP Single track: 48mm x 48mm - 610mm x 520mm M6IISP Double track: 48mm x 48mm
Used SMT Equipment | General Purpose Test & Measurement
Key Features & Specifications High Input Power Level: 2W Wavelength Flatness: High Attenuation Accuracy Repeatability Description The Keysight 81576A variable optical attenuator features lowest insertion loss and excellent wavelength flat
Used SMT Equipment | Pick and Place/Feeders
Model Specification : Model FUJI NXTII Board size: M3II/M6II Single track: 48mm x 48mm - 610mm x 534mm M3II/M6II Double track :48mm x 48mm - 510mm x 534mm M6IISP Single track: 48mm x 48mm - 610mm x 520mm M6IISP Double track: 48mm x 48mm
Used SMT Equipment | Pick and Place/Feeders
Model Specification : Model FUJI NXTII Board size: M3II/M6II Single track: 48mm x 48mm - 610mm x 534mm M3II/M6II Double track :48mm x 48mm - 510mm x 534mm M6IISP Single track: 48mm x 48mm - 610mm x 520mm M6IISP Double track: 48mm x 48mm
Used SMT Equipment | Coating and Encapsulation
Precision Valve and Automation SCS-4393 Photo Resist Spray Coater This *coater* appears to be in decent cosmetic condition, considering the process it performs. There are some signs of wear. Supposedly working when pulled from service, we
Used SMT Equipment | Pick and Place/Feeders
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
Used SMT Equipment | Repair/Rework
Metcal Array, Package Rework System This Metcal APR-5000 Series Rework System provides both accurate component placement and specifically tailored reflow profiles (through Metcal’s patented single component Micro Oven™) in one u
