Used SMT Equipment: bga alignment (Page 1 of 2)

Samsung CP45FV Neo

Samsung CP45FV Neo

Used SMT Equipment | Pick and Place/Feeders

CP45FV NEO  Popular CP45FV NEO. Highly Flexible, user friendly machine and highly reliable. Full vision with 6 placement heads, each with individual illumination allowing 6 totally different components to be aligned on the fly. Upward looking

Shenzhen Honreal Technology Co.,Ltd

Samsung SM421F

Samsung SM421F

Used SMT Equipment | Chipshooters / Chip Mounters

Make:  Samsung Model: SM421F Vintage:  2012 Details: (4) Spindle Head Assembly “On The Fly” Vertical Alignment Upward Vision Camera for Fine Pitch Components and BGA Ball Inspection Max Feeder Capacity: (120) 8mm Feeders (Feeders available separatel

Lewis & Clark

Samsung SM320 Chip Mounter

Samsung SM320 Chip Mounter

Used SMT Equipment | Pick and Place/Feeders

Samsung SM320 Pick and Place Machine Specifications: Chip theoretical speed :18500CPH Mounting range 0402mm Chip ~ □ 55mm IC Placement accuracy plus or minus 0.03mm PCB size 510 * 460-460 * 400mm Equipment size 50 x 40 mm ~ 460 x 400mm Co

Qinyi Electronics Co.,Ltd

Samsung CP40L  / CP40LV

Samsung CP40L / CP40LV

Used SMT Equipment | Pick and Place/Feeders

parameter:   1. Mounting head: 3   2. Alignment method: linear laser, video system (fixed camera)   3. Substrate size: Min:50*50*0.5(mm)-Max:460*400*4.0(mm), adjustable: 0.28-4.2t   4. Mounting speed: CHIP/ 0.22 seconds/CH

Shenzhen Honreal Technology Co.,Ltd

Manncorp MC385V2-V

Manncorp MC385V2-V

Used SMT Equipment | Pick and Place/Feeders

Manncorp MC385V2-V Pick and Place Vintage: 2014 Details:   Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 CPH

Lewis & Clark

Manncorp MC385V1-V

Manncorp MC385V1-V

Used SMT Equipment | Pick and Place/Feeders

Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability

Lewis & Clark

SRT Summit 2100RD

SRT Summit 2100RD

Used SMT Equipment | Repair/Rework

● Bottom and top heaters reflow solder to remove components with BGA, gull wing leaded QFPs, and bottom termination components. ●Paste dispenser allows placement of precise paste dots. ● Dual mirror system for component alignment for removal an

Capital Equipment Exchange

Assembleon Topaz X

Assembleon Topaz X

Used SMT Equipment | Pick and Place/Feeders

Assembleon Topaz X Multi-Fuction Placer With LCS Available! 4 Standard Change Heads & 4 FNC Heads Component Range:  0201 to 32mm Square   Placement Rate:18,000CPH (Chips), 2,500 (QPP)    Maximum Board Size:  460mm x 440mm (18.1" x 17.3")  

Thinking Productivity Inc

Essemtec Expert SAFP

Essemtec Expert SAFP

Used SMT Equipment | Pick and Place/Feeders

Expert-SAFP (110V/230V configurable) NEW PRICE EUR30.000,-, now for EUR 15.000 net (excl. Tax) only. Perfect for fast and reliable Prototyping. For sale is an Essemtec Expert-SAFP (110V/230V configurable). The Expert-SAFP is a professinal semi-

Arsenal Testhouse GmbH

DIMA MP100

DIMA MP100

Used SMT Equipment | Pick and Place/Feeders

Type Pick and Place machineDimension off-line (L x W x H) 2150 x 1700 x 1500 mm (+500 mm for signal light)Dimension in-line (L x W x H) 1750 x 1300 x 1500 mm (+500 mm for signal light)Board thickness min. 0.5 mm - max. 4.5 mm thickBoard size min. 30

Fix Trade BV

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