Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | Conveyors
onveyor Technologies MFIFO .6m -21 -4048 Date of Manufacture: 2018 Details: Vertical FIFO/LIFO/Pass throughEach Buffer Position Consists of a Moving Belt Surface to Provide Smooth transition In and Out of the Buffer21 Vertical Buffering SlotsAd
Used SMT Equipment | Conveyors
onveyor Technologies MFIFO .6m -21 -4048 Date of Manufacture: 2018 Details: Vertical FIFO/LIFO/Pass throughEach Buffer Position Consists of a Moving Belt Surface to Provide Smooth transition In and Out of the Buffer21 Vertical Buffering SlotsAd
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-S720-A MACHINE Hardware Configuration Image signal input unit Main unit Power supply Air Camera Illumination Image resolution Feed method Line height PCB carrier width adjustment Ambient operating temperature Ambient opera
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
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Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE300 (2004) Solder Paste Inspection Brand: Cyberoptics Model: SE300 Description: Solder Paste Inspection Serial: 10239 Year: 2004 Details: • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max pad size
Used SMT Equipment | Repair/Rework
Sierra 1800 BGA Rework Stations (2 stations Available) Vintage: 2011 Both Systems running Windows-Based Sierra Mate SW Version 8.3.9. Advanced Auto Profile, Programmable Pick and Place Force with Component Height Sensing, Independent Top Heater and
Used SMT Equipment | Chipshooters / Chip Mounters
SIEMENS F4 Type: SIPLACE 80 F4 Machine number: 00117100 Serial No: 364-9650 Year: 1998 Cycle count: 89679499 Type of Nozzle: for IC/Head (All version 4xx nozzles) 6-Nozzle Revolver Head -Max height: 8.5 mm -Max weight: 5g -Stroke of Z-axi
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