Used SMT Equipment | Assembly Accessories
we need Besi Die Bond: Type: Datacon 2200 Evo 8800FC ,2200 APM+
Used SMT Equipment | Semiconductor & Solar
Besi #DC8800FC Quantum High Speed Flip Chip Bonder Offline Curing Machine w/Datacon #Etx 1.1 Port Controls, Scanner, Power Supply: 3/N/PE/208/220/240/400 VAC, 50/60Hz, (Serial#: 950 8874 3355) Auction will be on April 3, 2018 at 11 AM Online Throug
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