Used SMT Equipment | Pick and Place/Feeders
Product number: KD - 2077 Products in detail Features: High speed dispensing/adapt to more stablerange Equal to KE series ofhigh-performance/operability Attaches great importance to thecompatibility and environment design Parameters: Substrate
Used SMT Equipment | Pick and Place/Feeders
Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standardequipped with three dispensing head, achieved 0.1 seconds/launch daub adhesiveat a high speed. Stable quality standards are equipped witheven daub glue residual wi
Used SMT Equipment | Soldering - Reflow
• Air • Edge Rail and Mesh • Temp: to 350Deg C • Power: 480V/50/60 HZ Condition: Complete and operational. Available for inspection prior to shipment.
Used SMT Equipment | Pick and Place/Feeders
YAMAHA Mounter-YG88 Mounter Products: Substrate size: L50×W50mm～L460×W440mm Substrate thickness: 0.4～3.0mm Board conveying direction: right→left Mounting accuracy: CHIP±0.05mm (μ＋3σ), CHIP±0.03mm (3σ)
Used SMT Equipment | Soldering - Reflow
Make: Vitronics Soltec Model: MyReflow 7038 Vintage: 2008 Details: • 8 Heated Zones • 2 Cooling Zones • Edge Rail • 350° Max Temp • Right to Left Condition: Complete & Operational Shi
Used SMT Equipment | Soldering - Reflow
Vitronics Soltec XPM2-1030 Reflow Oven Date of Manufacture: 2006 10 Heating Zones 3 Cooling Zones Windows 7 Operating System Air/ Nitrogen Switching Edge Rail Conveyor with Center Board Support Max Temp: 350° C 3 x 480v ~ 3 Ph
Used SMT Equipment | Pick and Place/Feeders
Board size L50 x W50mm to L460 (Max. L1200 OP) x W410mm Board thickness 0.5 to 2.0mm &nb
Used SMT Equipment | AOI / Automated Optical Inspection
BF-Frontier is used in the inspection of large-size printed circuit boards. In this device, the unique control sequence of software and hardware, accelerated scanning mode and stable optical illumination system can allow BF-Frontier to easily complet
Used SMT Equipment | Soldering - Selective
Make: Nordson ACE Model: KISS 103ILDP Description: This is Dual Pot Inline selective soldering system, with two selective soldering machines, tied together that can be run independently OR as a single inline selective system. This syste
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
