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Used SMT Equipment | Pick and Place/Feeders
Samsung Pick And Place Machine Decan Series Decan S1 Model DECAN S1 Alignment Fly Camera + Fix Camera The number of spindles 10 spindles x 1 Gantry Placement Speed 47,000 CPH (Optimum) Placement Accuracy ±28μm @ Cpk≥ 1.0 Component Ran
Used SMT Equipment | Pick and Place/Feeders
Equipment name: Fuji NXT-2, Fuji NXT II placement machine, second-hand Fuji NXT II placement machine Brief Introduction of Equipment Fuji NXT-2 parameters M3 II/M6 II: 48mm x 48mm~510mm x 534mm (dual carrying rails) &nbs
Used SMT Equipment | Pick and Place/Feeders
M3II fuji Chip Mounter NXT II Fuji NXT-M3II placement machine specifications: 1. Substrate size: 48mm*48mm-534mm*510mm (dual track specification) 48mm*48m
Used SMT Equipment | Chipshooters / Chip Mounters
The NXTR A model includes an automatic feeder exchange system that frees operators from changeover and supply work, with additional features that strengthen the ability to maintain high-quality and productivity. Fuji is paving the way to the future o
Used SMT Equipment | Pick and Place/Feeders
Online, Timed auction ending August 25th from 10am EDTSale of the complete assets of Ampere Inc. following their bankruptcy.View the complete catalogue here: https://www.bidspotter.com/en-us/auction-catalogues/bsccr/catalogue-id-bsccr10023View the Ma
Used SMT Equipment | Pick and Place/Feeders
Inventory Description Qty XXX00158 1001 NOZZLE 12 XXX00159 1002 NOZZLE 1 XXX00160 1253 NOZZLE 2 XXX00161 1005 NOZZLE 4 XXX00162 1523 NOZZLE 4 XXX00163 1004 NOZZLE 1 XXX00157 AC SERVO DRIVER 3 XXX00156 VACUUM PUMP 4 XXX00154 AC SERVO DRIVER 1
Used SMT Equipment | Pick and Place/Feeders
FUJI-NXT III NXT III Scalable Placement Platforms The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips
Used SMT Equipment | Pick and Place/Feeders
FUJI-NXT III NXT III Scalable Placement Platforms The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Used SMT Equipment | Chipshooters / Chip Mounters
1 High-speed mounting capacity handling 25, 000CPH(0.14sec/CHIP Equivalent: Optimum condition) +/-50μ M(CHIP), +/-30μ M(QFP)mounting absolute accuracy in full time operation 2 Handles a wide range of components from 0402 chips to W45xL100mm or less
