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Used SMT Equipment | Assembly Accessories
Panasonic's BM231 modular high speed multi-functional placement machine boasts any volume, any mix capability by placing a wide array of components from 0402 (01005) microchips to BGA's, CSP's and connectors. Outstanding productivity is a
Used SMT Equipment | Chipshooters / Chip Mounters
BM231 NM-MF13 Panasonic placement machine BM231 parameter: Speed: 0.25S, Loading racks: 60 (double-tape racks 120) pallet 80 stations Component type: 0603-55mm Power supply: 3P/200V/8, Dimensions: 1950/2060/1500mm Weight: 2000kg Suitable c
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE XS: SIPLACE SpeedStar for high-speed and placement of components as small as 0201 (metric) with maximum precision SIPLACE MultiStar – the only head that automatically changes modes on demand (C&P, P&P, Mixed Mode) SIPLACE Tw
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Used SMT Equipment | Pick and Place/Feeders
Placement performancea: IPC value 125,000 comp./h Benchmark value 150,000 comp./h Theoretical value 200,000 comp./h Placement Accuracy: ± 22 µm, (3σ) &n
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
