Used SMT Equipment: flip chip bonder finetech (Page 1 of 1)

Besi / ESEC 8800FC

Besi / ESEC 8800FC

Used SMT Equipment | Semiconductor & Solar

Besi #DC8800FC Quantum High Speed Flip Chip Bonder Offline Curing Machine w/Datacon #Etx 1.1 Port Controls, Scanner, Power Supply: 3/N/PE/208/220/240/400 VAC, 50/60Hz, (Serial#: 950 8874 3355) Auction will be on April 3, 2018 at 11 AM Online Throug

Paul E. Saperstein Co., Inc

Panasert FCB-2M  some sets of machinery online auction.

Panasert FCB-2M some sets of machinery online auction.

Used SMT Equipment | Conveyors

Speedlines Camalot1818 Underfill     Agilent SJ 50 AOI     Universal GSM PTF     Panasonic FCB-2M Flip Chip Bonder       Speedlines MPM accuflex Solder Paste Printer       DEK 265 GSX Solder Paste Printing      Autolink Engineering PTE LTD R4200 Offl

CS-Auction,Co,Ltd

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flip chip bonder finetech searches for Companies, Equipment, Machines, Suppliers & Information

Selective Soldering Nozzles

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Pillarhouse USA for handload Selective Soldering Needs

High Throughput Reflow Oven
best pcb reflow oven

World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

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