Used SMT Equipment | Pick and Place/Feeders
Hybrid Placer (advanced flip chip and die bonder) Model : YHP-2 Maker : Yamaha Vintage : 2012 2 sets L → R Max : L300mm x W200mm Min : L30mm x W30mm CL Tape Feeder 8mm 15inch STD t0.3mm 4mm pitch （ 5 pieces） Nozzles (61, 6A) 4
Used SMT Equipment | Semiconductor & Solar
Besi #DC8800FC Quantum High Speed Flip Chip Bonder Offline Curing Machine w/Datacon #Etx 1.1 Port Controls, Scanner, Power Supply: 3/N/PE/208/220/240/400 VAC, 50/60Hz, (Serial#: 950 8874 3355) Auction will be on April 3, 2018 at 11 AM Online Throug
Used SMT Equipment | Conveyors
Speedlines Camalot1818 Underfill Agilent SJ 50 AOI Universal GSM PTF Panasonic FCB-2M Flip Chip Bonder Speedlines MPM accuflex Solder Paste Printer DEK 265 GSX Solder Paste Printing Autolink Engineering PTE LTD R4200 Offl
| 1 |
