Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale We have (2) identical systems available..... Both can be inspected under power..... Equipment Description Camalot FX-D Model: 8000-1 Year 5/
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale (2) identical systems available..... Both in very good running condition and can be inspected under power..... See attached pictures and inform
Used SMT Equipment | Pick and Place/Feeders
ASM Siplace HF-3 Pick And Place Machine Features: The SIPLACE HF-3 placement the system is particularly suitable for applications that demand a high level of flexibility, utmost precision, and a high placement rate. Vintage: Year 2006 PCB Directi
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | AOI / Automated Optical Inspection
2011 MIRTEC MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13110930-0839 DOM: 30 SEP 2011 2D Inspection Power: 85-264V / 4.4A / 50-60 Hz INSPECTION AREA: 450 x 400 mm INSPECTION ITEMS:&n
Used SMT Equipment | AOI / Automated Optical Inspection
2015 MIRTEC MV-3U LARGE PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13150216-1452 DOM: 16 FEB 20152D Inspection5 Camera Inspection SystemPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 660mm x 510 mmIN
Used SMT Equipment | Pick and Place/Feeders
Hybrid Placer (advanced flip chip and die bo der) Model : YHP-2 Maker : Yamaha Vintage : 2012 2 sets
Used SMT Equipment | Pick and Place/Feeders
GSMX Vintage 2000 EPC9 For CSP and flip chip application 1 flexhead 2 cameras C4 high force head EPC9 Excellent condition Available for immediate delivery. Elexin Engineering
Used SMT Equipment | Pick and Place/Feeders
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
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Used SMT Equipment | AOI / Automated Optical Inspection
2010 SAKI BF-Frontier II AOI 100% Operational / Tested 18μm and scanning line color CCD camera Board size 2x2.4in. to 18x20 in. Inspection of (presence/absence, misalignment, tombstoning, reverse polarity, bridging, foreign material,
