Used SMT Equipment | AOI / Automated Optical Inspection
YAMAHA AOI YSi-12 KKH-000 High-Speed High-Precision Hybrid AOI (YSi-12) Specifications Model YSi-12(Model:KKH-000) Applicable PCB L600 x W460mm～L50 x W50mm※An optional case, L780×W460mm～L50×W50mm Visible rays Visible ray
Used SMT Equipment | AOI / Automated Optical Inspection
High-Speed High-Precision Hybrid AOI (YSi-12) Specifications Model YSi-12(Model:KKH-000) Applicable PCB L600 x W460mm～L50 x W50mm※An optional case, L780×W460mm～L50×W50mm Visible rays Visible ray/infrared ray:19μm (Pos
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti
Used SMT Equipment | Screen Printers
Right; Right->Left; Left-> Left; Right->Right Transport Speed: Max 1500mm/S ProgrammablePrinthead: Two independent motorized printheads Squeegee Speed: 6~200mm/sec Squeegee Pressure: 0~15Kg Squeegee Angle: 60°/55°/45° Squeegee Typ
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Used SMT Equipment | AOI / Automated Optical Inspection
YAMAHA AOI YSi-V MACHINE KLT-000 1. Model: Yamaha ysi-v 2. Target substrate: l610 x w560 (maximum) ~ l50 x w50 (minimum) & supports l750mm super long substrate (optional) 3. Resolution: visible light (red/green/blue) & infrared (infra-
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Used SMT Equipment | SPI / Solder Paste Inspection
The LSM300 follows the successful Laser section Microscopes LSM and LSM2. This new non-contact laser based system is an off-Line solder paste inspection system.LSM300 provides automatic height measurements, eliminating the inconsistencies of manual m
Used SMT Equipment | AOI / Automated Optical Inspection
Agilent SP-50 Automated solder paste inspection system. 24x30" machine. 3D paste inspection system system.
