Used SMT Equipment | Soldering - Selective
Hot Bar Soldering Flex Circuit to PCB Ribbon Cable to PCB Coaxial Cables Fine Pitch SM Devices Edge Connectors to PCB Thermocompression Bonding Tab to PCB, HSC to LCD or tab More information pjbril@smtunion.com m.madera@smtunion.com W
Used SMT Equipment | Soldering - Selective
Thermode Length 100mm, Stroke 50mm, Flex Bond 1/2inch Force 10 to 100N @ Bar Preheat/Reflow 0-200 Seconds Work Area 260X200mm Temp Range 25 to 400c in 1 degree Intervals Voltage 110/220 CCD Camera System with Monitor Condi
Used SMT Equipment | SMT Equipment
Auction: Phoenix X-Ray PCB Analyser, Wafer Probers, Test Chambers, Hot Bar Bonders, Dicing Saws & More Featuring: BAE - Manassas, Virginia USA • V.J. Technologies VJ-1000 X-Ray System A World Class Semiconductor Mfg. Co. - Hayward, California USA
Used SMT Equipment | Pick and Place/Feeders
Eight heads, 13.9K/17.7K (IPC9850/ rate 01005 (0402)-45 mm sq. (1.8'' sq.) fine pitch, accuracy 35 microns @ 3 sigma, 100mm long connections, 8 nozzles (2x nozzle 71, 72, 73 1 x nozzle 74, 76A), 50 position feeder bar with valves front and rear side,
Used SMT Equipment | Pick and Place/Feeders
Juki KE-207E High-Speed Chip Shooter Date of Manufacture: 2010 Direction: Left to Right Accessories: 2 Feeder Trolley Component Height: 6mm/12mm Component Size: – Laser Recognition 01005 to 33.5 x 33.5 mm – Vision Recognition 1.0 x 0.5 to 33.5
Used SMT Equipment | Pick and Place/Feeders
IPLACE D4 is a very powerful placement machine, equipped with four cantilevers and four 12-nozzle collection and placement heads, not only can achieve a precision of 50 microns, but also can mount 01005 components. ***Combining*** and ***flexibility
Used SMT Equipment | Pick and Place/Feeders
Manncorp MC385V2-V Pick and Place Vintage: 2014 Details: Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 CPH
Used SMT Equipment | Pick and Place/Feeders
Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability
Used SMT Equipment | Soldering - Reflow
Intelligent hot air lead-free reflow Oven with six heating-zones TN360C Instruction: 1: Heating system: TN360C adopts high effective nickel-chromium heating tube with advanced technology and Long life service. The hot-air circle system wh
Used SMT Equipment | Soldering - Wave
Windows: XP Version 2002, Service Pack2, KBM Premium Industrial Computer. Vectra Software: Version 3.05.0 Titanium Solder Pot w/ Custom 12” Titanium Ducts/Nozzles (Ultra-Fill & Rotary Chip Wave). Bar Solder Feeder Titanium Solder Pump
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
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