Used SMT Equipment | Pick and Place/Feeders
2010 Universal Genesis 4992B GX11S Placement Machine Product Tree No. 51194202
Used SMT Equipment | Pick and Place/Feeders
2010 Universal Genesis 4990E GC60D Placement Machine Product Tree No. 48714305
Used SMT Equipment | SMD Placement Machines
Universal 60 Station 6241C and 6772 DIP. Auto Insertion Equipment. Available Now.
Used SMT Equipment | Pick and Place/Feeders
Details: • Version UPS+ 8.3.1.3 • Single Gantry, 7 Inline Heads • PEC Firewire Camera • PCB MAX 18X20 • Only 4.4 Million Placements • Voltage 240 Condition: Complete and Operational. Location & Shipping: USA / FOB Origin Availability: Im
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Used SMT Equipment | Pick and Place/Feeders
Model: Genesis GX-11 Details: • Windows XP Operating System • Software Version: 8.3.0.10 • Front ULC Magellan Camera • PEC Camera on Beam 1 & Beam 2 • Includes (1) Parts Tray Feeder
Used SMT Equipment | Pick and Place/Feeders
Software Release: 8.5.5.4 Details: • Dual Beam • (2) Lightening Heads • 60 Spindles (30 per Head) • 3 Spindle Series • 4 x 70 Nozzle Changer • Single Line • Dual Board Stop • UPS Version: 08.05.2000 &
Used SMT Equipment | Pick and Place/Feeders
Software Release: 8.5.5.4 Details: • Dual Beam • (2) Lightening Heads • 60 Spindles (30 per Head) • 3 Spindle Series • 4 x 70 Nozzle Changer • Single Line • Dual Board Stop • UPS Version: 08.05.2000 &
Used SMT Equipment | Pick and Place/Feeders
Panasonic placement machine cm212 features one: Achieved a maximum of 54,000 CPH (0.067s/pcs) Actual efficiency 38,000 CPH (0.098s/pcs) Substrate transport time…3.6 s (～substrate X=215㎜)
