Used SMT Equipment | Screen Printers
DEK Horizon 02i Automatic Screen Printer Dek Horizon 02 Specifications: Dek Horizon Repeatability: 1.6 Cpk @ 25µm Cycle time: As fast as 10 seconds Setup time less than 10 minutes Changeover time: less than 2 minutes Optimi
Used SMT Equipment | SMT Equipment
Product Name: Samsung EXCEN-PRO Product number: Samsung EXCEN-PRO Detailed product introduction Samsung EXCEN-PRO high speed chip mounter parameters EXCEN is equipped with 16 suction nozzles, rotary head of the high-speed modular chip mounter, it
Used SMT Equipment | SMT Equipment
Product Name: Samsung EXCEN-PRO Product number: Samsung EXCEN-PRO Detailed product introduction Samsung EXCEN-PRO high speed chip mounter parameters EXCEN is equipped with 16 suction nozzles, rotary head of the high-speed modular chip mounter, it
Used SMT Equipment | Pick and Place/Feeders
K&S PIXALUX High Speed LED Placement Machine Model: PIXALUX Year: 2018 Micro & Mini LED Placement High productivity and yield with its ultrafast placement head design Placement accuracy and speed on multiple types of substrates Supports placement o
Used SMT Equipment | AOI / Automated Optical Inspection
YAMAHA YSI-V AOI Year : 2019 / 2020 Model YSi-V Applicable PCB mm L610 x W560 (Max) to L50 x W50 (Min) (Single lane) Note:L750mm long length PCBs available (option) Numbe
Used SMT Equipment | Screen Printers
Windows 10 Software Machine Alignment Capability: ±12.5 µm @ 2.0 Cmk, (±6 Sigma) System Alignment Capability: +/- 20μm @ 2.0 Cmk, (±6 Sigma) Wet Print Capability: ±25 µm @ 2.0 Cpk, (±6 Sigma) - Cer
Used SMT Equipment | Pick and Place/Feeders
SM321S 1608CHIP: 21K CPH(IPC) 1005CHIP: 20K CPH(IPC) SOP16: 15K CPH(IPC)/feeder QFP100: 5.5K CPH(IPC)/pallet The placement accuracy of Samsung SM321: CHIP: ±50µm (0402@3σ) QFP: ±30µm (QFP168@3σ) The PCB b
Used SMT Equipment | Pick and Place/Feeders
SM321S 1608CHIP: 21K CPH(IPC) 1005CHIP: 20K CPH(IPC) SOP16: 15K CPH(IPC)/feeder QFP100: 5.5K CPH(IPC)/pallet The placement accuracy of Samsung SM321: CHIP: ±50µm (0402@3σ) QFP: ±30µm (QFP168@3σ) The PCB b
Used SMT Equipment | AOI / Automated Optical Inspection
Non-blind spot digital 8 projection moiré 3D inspection technology Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting Smallest componentinspection by ultra-high resolution camer
Used SMT Equipment | Pick and Place/Feeders
Model name CM602-L model NM-EJM8A Substrate size L 50 mm × W 50 mm 〜 L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip <A-2 type>)
