Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Soldering - Reflow
Reflow Oven by SEHO, in good condition. SEHO Go Reflow 2.3 Reflow Oven product information. compact machine technology high number of heating zones and full convection ensure perfect results efficient and homogeneous heat transfer because of o
Used SMT Equipment | Soldering Equipment/Fluxes
The MWM 3250 is a modular selective SOLDERING system which may be totally tailored to meet your production requirements. It means: *maximum flexibility with: - different working stations, as for instance fluxer units, solder units, preheat units, t
Used SMT Equipment | Soldering Equipment/Fluxes
The MWM 3250 is a modular selective SOLDERING system which may be totally tailored to meet your production requirements. It means: *maximum flexibility with: - different working stations, as for instance fluxer units, solder units, preheat units, t
Used SMT Equipment | Tape and Reel
Table top component counter Accepts reel widths from 8-56mm, includes 2mm pitch Minimum part sizes: 2mm x 2mm or 0805 (operator/settings dependent) Device Size Chart Accepts 7" and 13" reel diameters with standard arms and 22" reels when
Used SMT Equipment | Screen Printers
DEK Horizon 03i Stencil Printer Vintage: 2009 Very Clean, single shift, low hours. Camera: Graphite digital camera, using IEEE 1394 interface. Single channel. LED lighting FOV 5m 8.5mm. Vision Inspection, Paste on Pad, Verification of percentag
Used SMT Equipment | SPI / Solder Paste Inspection
Agilent SP50 Series II 3D SPI 3D Solder Paste Inspection System Model: SP50 Series II Vintage: 2006 Maximum board size: 510 by 510 mm (20 by 20 in) Minimum board size: 50 by 50 mm (1.97 by 1.97 in) Maximum board thickness: 4 mm (0.16 in) 2D an
Used SMT Equipment | SPI / Solder Paste Inspection
ASC VisionPro M500 3D Solder Paste Inspection System (2019) Brand: ASC InternationalModel: M500 3D Solder Paste Inspection SystemS/N: PSI-107Year: 2019Software: ASCan ULTRA Version 2.4.4.5O/S: Windows 10 Pro System SpecificationsMaximum Object Thickn
Used SMT Equipment | SPI / Solder Paste Inspection
ASC VisionPro M500 3D Solder Paste Inspection System (2019) Brand: ASC InternationalModel: M500 3D Solder Paste Inspection SystemS/N: PSI-107Year: 2019Software: ASCan ULTRA Version 2.4.4.5O/S: Windows 10 Pro System SpecificationsMaximum Object Thickn
Used SMT Equipment | General Purpose Test & Measurement
Key Features & Specifications 25 µs minimum averaging time and 17 kHz analog bandwidth Dynamic range > 55dB in manual range mode Power uncertainty of ±3% Low polarization dependence of <±0.015dB 100,000 measurement
