Used SMT Equipment | Flexible Mounters
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
JUKI Mounter fx-1r parameters: Board size: 410*360mm Component height: 6mm 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) Two independent multi-nozzle laser heads (8 total nozzles) from 0603 （0201） to 20mm square components or 26.5×
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | Pick and Place/Feeders
Concept: Over drive motion Ultimate access Super wide range DDH V5 Smart operation Voluntary line operation Wide open &Easy access Quick exchange Auto changeover PP type LISA Feeder hot swap Chip theory speed 84500chip Placement ra
