Used SMT Equipment | Pick and Place/Feeders
NXTR offers a truly modular design for the optimal line configuration that caters to your production.Real-time sensing placement, optimized placement actions, and part handling checks after placement are just a few examples. This high end model machi
Used SMT Equipment | Chipshooters / Chip Mounters
The NXTR-S model offers a truly modular design for the optimal line configuration that caters to your production.Real-time sensing placement, optimized placement actions, and part handling checks after placement are just a few examples. This high-end
Used SMT Equipment | SPI / Solder Paste Inspection
KY8030-2 The industry's Most Popular True 3D Solder Paste Inspection Solution . Best-in-dass measurement accuracy and inspection reliability -Solves shadow problems by utilizing 2-way projection - Accurate inspection data with real-time P
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Used SMT Equipment | Pick and Place/Feeders
JUKI Fast Smart Modular Mounter RS-1RSuperior Productivity. VersatilityWith the best throughput in an advanced, all-in-oneFeature 1 Automatic height change of recognition sensor “The 8-nozzle “”Takumi head”” automatically changes the laser sensor hei
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
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