Used SMT Equipment | Pick and Place/Feeders
Device Name: Fuji CP643ME, Fuji CP643ME Mater, Second-hand Fuji CP643 Mater Equipment Profile: The second-hand Fuji CP643 patch machine is roughly 99 years old, with a total of 16 mount heads. Each mount head can be fitted with 6 suction pins at th
Used SMT Equipment | SPI / Solder Paste Inspection
SPI PARMI SPI HS60L PARMI solder paste inspection machine SPI HS60 product introduction: 1. The SPI HS60 Series series is PARMI's best-selling model. It has been installed in excellent SMT production sites around the world. Its performance st
Used SMT Equipment | Pick and Place/Feeders
JUKI KE-2080 Pick and Place Machine Since entering the electronics industry equipment field in 1987, JUKI has pioneered a new field with its original modular mounters that match the production innovation required by the electronics industry. The comp
ECD M.O.L.E. Lot comes with the following, everything is complete and fully functional, manuals included, plus and spare parts. 1) ECD M.O.L.E. Xpert 3 profile module 2) ECD Xpert 3 Docking station 3) SUPER M.O.L.E. Gold thermocouple system. 4) ECD O
Used SMT Equipment | Soldering - Reflow
2 QUAD Profile S Reflow Ovens Model: PRO-S-5-C Serial Number: 9804799 This is 2 reflow ovens for $8000.00. One is operational and the other is a complete machine but not operational and can be used for parts. One machine was fully operational
Used SMT Equipment | Conveyors
This is a like new (trade show and demo room only) system. The EAC-7000 is a 2 operator manual slide line that uses a stationary steel roller chain to support PCB. A removable hand crank adjusts to 18 inches, overhead lighting, low profile front fasc
Used SMT Equipment | Soldering - Reflow
In a very good condition. It is actually drying and curing oven but you can easily use it, with a few modifications, as reflow oven. The ERSA HOTFLOW 2 line consists of various machine types all based on the same design. They are only set apart by t
Used SMT Equipment | Semiconductor & Solar
Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac
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