Used SMT Equipment: plating shadow (Page 1 of 1)

Vi Technology 3D SPI

Vi Technology 3D SPI

Used SMT Equipment | SPI / Solder Paste Inspection

Make: VI Technologies Model: 3D Solder Paste Inspection Vintage: 2009 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow free ins

Lewis & Clark

Vi Technology 3D XPi 400L

Vi Technology 3D XPi 400L

Used SMT Equipment | Visual Inspection

Make: VI Technolgoies Model: 3D XPi 400L Solder Paste Inspection Vintage: 2008 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow

Lewis & Clark

Vi Technology 3D SPI SOLDER PASTE INSPECTION (AOI)

Vi Technology 3D SPI SOLDER PASTE INSPECTION (AOI)

Used SMT Equipment | SPI / Solder Paste Inspection

Vi Technology 3D SPI In-line Solder Paste Inspection (AOI) System • Model: 3D XPI 4000L • Vintage: 04/2008 • Voltage 220 • FAHP (Flying Absolute Height Profilometry) Measurement method • Dual Light Source and On-the-fly Image scan • High power M/H li

Recon Inc

Vi Technology 3D SPI SOLDER PASTE INSPECTION (AOI)

Vi Technology 3D SPI SOLDER PASTE INSPECTION (AOI)

Used SMT Equipment | SPI / Solder Paste Inspection

Vi Technology 3D SPI In-line Solder Paste Inspection (AOI) System • Model: 3D SPI • Vintage: 11/2009 • Voltage: 220 • FAHP (Flying Absolute Height Profilometry) Measurement method • Dual Light Source and On-the-fly Image scan • High power M/H light 3

Recon Inc

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