Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Used SMT Equipment | SPI / Solder Paste Inspection
KY8030-2 The industry's Most Popular True 3D Solder Paste Inspection Solution . Best-in-dass measurement accuracy and inspection reliability -Solves shadow problems by utilizing 2-way projection - Accurate inspection data with real-time P
Used SMT Equipment | Screen Printers
Right; Right->Left; Left-> Left; Right->Right Transport Speed: Max 1500mm/S ProgrammablePrinthead: Two independent motorized printheads Squeegee Speed: 6~200mm/sec Squeegee Pressure: 0~15Kg Squeegee Angle: 60°/55°/45° Squeegee Typ
Used SMT Equipment | Screen Printers
HORIZON 02i Approx. Weight 820kg boxed 677kg unboxed Approx. Dimensions 2060mm x 1500mm x 1570mm (81.1” x 59” x 61.8”) Accuracy and Repeatability 1.6 Cpk @ +/- 25 m Cycle Core Time 12 seconds Max. Board Size (Print Area) 508mm (X) x 508mm (Y)
Used SMT Equipment | Screen Printers
Type A Screen frame size (X)650×(Y)550mm (T)25～40mm (X)750×(Y)650mm (X)29'×(Y)29' Accommodated PCB/substrate size Minimum(X)50×(Y)50mm (T)0.4～2.5mm Maximum(X)330×(Y)250mm Overall Size (D)1235×
Used SMT Equipment | Pick and Place/Feeders
SIPLACE TX highlights: NEW: SIPLACE SpeedStar with up to 48,000 cph and maximum component size of 8.2 mm x 8.2 mm x 4 mm with a placement accuracy of up to 25 µm/3 sigma SIPLACE MultiStar: Up to 25,500 cph SIPLACE TwinStar: The head for special tasks
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
