Used SMT Equipment | AOI / Automated Optical Inspection
The Parmi Xceed New Generation 3D AOI range of systems can detect all defect types that relate to component placing and soldering. Its high speed CMOS camera with dual-laser technology can easily identify missing, lifted, misaligned and tomb-stoned c
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Used SMT Equipment | Pick and Place/Feeders
Productivity On the Fly mounting method Identifies components without stopping while moving after picking them up Dramatically reduces travel time between the pick and place position and reduces identification time to zero Performance Dual-lane tra
Used SMT Equipment | Pick and Place/Feeders
ASM Siplace HF-3 Pick And Place Machine Features: The SIPLACE HF-3 placement the system is particularly suitable for applications that demand a high level of flexibility, utmost precision, and a high placement rate. Vintage: Year 2006 PCB Directi
Used SMT Equipment | Pick and Place/Feeders
ASM Siplace HS60 Pick And Place Machine Vintage: Year 2006 PCB Direction: Left to Right Heads: Condition: Refurbished, working Running Hours: Series Number: Feeders: Missing Parts: No Warranty: 6 Months after instllation Location: China Lead time: 7
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | Pick and Place/Feeders
FUJI CP65 Components Mounting Machine Lot Informations: Year:1997 Manufacturer:FUJI S/N:578 Running Condition Main Auction: DEK Galaxy Auto Solder Paste Printer DEK Europa Auto Solder Paste Printer Fuji CP65 / CP65E Placement Machine Fuji CP
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
