Used SMT Equipment | In-Circuit Testers
Exfo A4000 EFOS/EXFO A4000 E3000 N2001 UV Light Curing System EFOS Light Guide The Acticure 4000 UV spot-curing system can be tailored to specific applications by using interchangeable optical filters and employing its more than 20 000 mW/cm2 o
Used SMT Equipment | In-Circuit Testers
Exfo A4000 EFOS/EXFO A4000 E3000 N2001 UV Light Curing System EFOS Light Guide The Acticure 4000 UV spot-curing system can be tailored to specific applications by using interchangeable optical filters and employing its more than 20 000 mW/cm2 o
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Pick and Place/Feeders
Make: JUKI Model: JUKI KE-2050M Details:1.High Mounting Speed: Chip component mounting speed of 13,200 CPH (optimal conditions) .2.Laser Recognition Technology: Utilizes laser recognition technology for high precision mounting .3.Multi-functional No
Used SMT Equipment | Pick and Place/Feeders
Make: SumsangModel: Decan S1 Details:1.Maximum PCB Handling Size: Standard size is 510x510mm, optional size is 1500x460mm, capable of handling PCBs up to 1500mm(L) x 460mm(W). 2.Mounting Speed: Up to 47,000 CPH (under optimal conditions). 3.Mounting
Used SMT Equipment | Pick and Place/Feeders
Make: SumsangModel: Decan S2 Details:1.High-Speed Performance: It can achieve a placement speed of up to 92,000 CPH, ensuring production efficiency .2.High Precision: Placement accuracy is ±28μm Cpk≥1.0 for 03015 chips and ±25μm Cpk≥1.0 for ICs, gua
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