Used SMT Equipment | Flexible Mounters
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Used SMT Equipment | Pick and Place/Feeders
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Used SMT Equipment | Pick and Place/Feeders
Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laseridentification chip ~20mm component or 26.5*11mm Component mounting spee
Used SMT Equipment | SMT Equipment
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Used SMT Equipment | Chipshooters / Chip Mounters
JUKI SMT Machine JX-350 LED high speed SMT machine Technical parameters: P C B size：1 transfer650㎜×360㎜/Two moves1,200㎜×360㎜/3 moves 1,500㎜×360㎜ Component Height:6mm/12mm Component range:0603 (British 0201) ~ □33.5㎜ Component
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Used SMT Equipment | Pick and Place/Feeders
Panasonic placement machine cm212 features one: Achieved a maximum of 54,000 CPH (0.067s/pcs) Actual efficiency 38,000 CPH (0.098s/pcs) Substrate transport time…3.6 s (～substrate X=215㎜)
Used SMT Equipment | Pick and Place/Feeders
Manncorp MC385V2-V Pick and Place Vintage: 2014 Details: Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 CPH
Used SMT Equipment | Pick and Place/Feeders
Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability
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