Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV multi-function chip mounter Product number: CP45FV Detailed product introduction Samsung CP45FV multi function placement: Mounting head: 6 mounting head Servo system: servo motor drive X, Y shaft - Z axis shift drive
Used SMT Equipment | SMT Equipment
Product name: KE - 3020 va/VRA general placement machine at a high speed Product number: KE - 3020 va/VRA Detailed product introduction Constantly improve the KE series products. So as to realize the high speed high quality electric production
Used SMT Equipment | SMT Equipment
Product name: RX - 6 high-speed module chip mounter Product number: RX - 6 Detailed product introduction Characteristic： With high productivity, versatility, high quality new modular placement machine RX - 6 listed Draw/monitor corresponding p
Used SMT Equipment | Semiconductor & Solar
Yamaha YS24 SMT mahcine Model YS24: (Note: high-speed machine) Object substrate： L50 x W50mm to L700 x W460mm Mount capacity： 72,000CPH (0.05s /CHIP: our best condition) Mounting accuracy： ±0.05mm(μ+3σ), ±0.03mm(3σ)
Used SMT Equipment | Semiconductor & Solar
V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
Y100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate thickness: 0.4 to 3.0 substratetransfer direction
Used SMT Equipment | Semiconductor & Solar
Model YV100II SMT speed :0.25 SEC /CHIP high speed mount Substrate size: L600*W400(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 Mounting accuracy ± 0.1mm/CHIP ±0.08/QFP Power three-phase AC220/208/230/240/380/400/416 v + / - 10%,
Used SMT Equipment | Semiconductor & Solar
Product number: YS24 Products in detail Features: 72000 CPH (0.05 SEC/CHIP) abilityoutstanding pasted on the new development of double period of delivery 34 KCPH / ㎡ area of the world'sbest productivity L700x W460mm corresponding to ver
