Used SMT Equipment | SMT Equipment
1996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/ 208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: No Feeders or Feeder Tables are included in this lo
Used SMT Equipment | Pick and Place/Feeders
996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz
Used SMT Equipment | Assembly Accessories
Description: This equipment is equivalent to SMD machine or operator testing station of PCB assembly equipment. Belt type: Antistatic oblate belt Conveying speed: 0.5-20M/min or customer specified Power supply: AC 110 or 220V, single phase
Used SMT Equipment | Pick and Place/Feeders
IPLACE D4 is a very powerful placement machine, equipped with four cantilevers and four 12-nozzle collection and placement heads, not only can achieve a precision of 50 microns, but also can mount 01005 components. ***Combining*** and ***flexibility
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Used SMT Equipment | Pick and Place/Feeders
Supply of FUJI Fuji CP643E high-speed patch machine in online production: FUJI CP643E high-speed patch machine Features: 1, shooting speed is 0.09 seconds. 2, frontal video processing and advanced gray ratio video processing system. 3, a fixer p
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Used SMT Equipment | Pick and Place/Feeders
JUKI Chip Mounter – KE 2050M The best system for high-speed placement of small components. As part of a “modular concept”, the KE-2050 can be the base of a flexible placement system line designed specifically to meet the require
Used SMT Equipment | Pick and Place/Feeders
Siemens SiPlace S27 HM Auction Item - Auction Starts Son Please see site for additional photos and descriptions. www.xlineassets.com Also Available SMT Equipment: 2005 Siemens SiPlace S27 HM (2) 1999 Siemens SiPlace 80 S20 (2) 1999 Siemen
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