Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
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Used SMT Equipment | Pick and Place/Feeders
The NPM-TT2 (Next Production Modular-Twin Tray II) platform represents the next generation in twin tray modular production from Panasonic’s award-winning NPM platform—ideal for any mix. Further bolstering the SMT process to accommodate m
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Used SMT Equipment | Assembly Accessories
Panasonic's BM231 modular high speed multi-functional placement machine boasts any volume, any mix capability by placing a wide array of components from 0402 (01005) microchips to BGA's, CSP's and connectors. Outstanding productivity is a
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE500 3D SPI Vintage: 2013 3D Height, Volume, and Area Measurements Max PCB Size: 20" x 20" Min PCB Size: 2" x 2" Complete & Operational
Used SMT Equipment | Soldering - Selective
Vitronics Soltec Zeva V Selective Soldering Date of Manufacture: 2018 Details: Inline Preheat Offline Programming Auto Width Adjust SMEMA Interface Advanced Solder Feeder Max PCB: 310 x 410mm Solder Pot Volume: MW 180kg / SW 45kg
Used SMT Equipment | SPI / Solder Paste Inspection
Vintage: 2008 Description: 3D Solder Paste Inspection Details: • 3D sensing system w/ built-in fiducial camera and lighting • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max PCB width: 20” x 20” • Max inspection
Used SMT Equipment | SPI / Solder Paste Inspection
The inspection speed is much faster to meet requirements of high speed of production lines. CKD pursuits the high speed operation and achieves the fastest speed, 8000mm2/sec., in the SMT market. (25um Standard Machine Inspection) It supports the prod
Used SMT Equipment | SPI / Solder Paste Inspection
Make: VI Technologies Model: 3D Solder Paste Inspection Vintage: 2009 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow free ins
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG KY8030-2 3D SPI The World's Best-selling Full 3D Solder Paste Inspection Best-in-class measurement accuracy and inspection reliability Solves shadow problems by utilizing 2-way projection Provides accurate inspection data with real-time P
Used SMT Equipment | SPI / Solder Paste Inspection
Description: 3D Solder Paste Inspection System Vintage: 2016 O/S: Windows 7 Ultimate Details: • 4-Way High Speed Projection Upgrade (for KY8030-3) 3D Inspection GUI, Gerber conversion software • SPC Plus software(Statistical P
