Used SMT Equipment: systemation 20mm 230 (Page 1 of 20)

Viscom S3088AV

Viscom S3088AV

Used SMT Equipment | AOI / Automated Optical Inspection

Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:

Baja Bid

Yamaha KS-6004-S Portable conveyor KINGSUN

Yamaha KS-6004-S Portable conveyor KINGSUN

Used SMT Equipment | SMT Equipment

Model No:KS-6004-S Portable conveyor Cycle time:Approx 15seconds  Power supply:100-230V AC (customized), single phase  Power load:Max 150V/A Air pressure: 4-6 bar Air volume:MAX 10L/minute Transport height:900±20mm (or customized) Transport di

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki KE - 2010L

Juki KE - 2010L

Used SMT Equipment | Pick and Place/Feeders

Product number: KE - 2010L Products in detail Substrate size: Min: 50 mmx30mm Max: 330mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square elementor 26.5 X11mm Mount speed: 11000 CPH SMT precision: 0.05 MM Elem

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki KE - 2010 l  chip mounter

Juki KE - 2010 l chip mounter

Used SMT Equipment | Flexible Mounters

Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki original KE - 2010 l JUKI chip mounter

Juki original KE - 2010 l JUKI chip mounter

Used SMT Equipment | SMT Equipment

Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki KE - 2010 l JUKI chip mounter

Juki KE - 2010 l JUKI chip mounter

Used SMT Equipment | SMT Equipment

Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki Chip Mounter KE-2050M

Juki Chip Mounter KE-2050M

Used SMT Equipment | Pick and Place/Feeders

JUKI Chip Mounter – KE 2050M The best system for high-speed placement of small components. As part of a “modular concept”, the KE-2050 can be the base of a flexible placement system line designed specifically to meet the require

Qinyi Electronics Co.,Ltd

Juki KE2050M

Juki KE2050M

Used SMT Equipment | Pick and Place/Feeders

Model KE 2050M Board size (330×250mm) Component height 6MM Laser recognition 0603(0201) ~20×20mm or 26.5×11mm Placement speed 13200CPH Feeder inputs Max. 80 on 8mmT/F(※7) Power supply 200 to 415 VAC, 3-phase

Qinyi Electronics Co.,Ltd

Ekra Serio 4000 Vision Alignment System

Ekra Serio 4000 Vision Alignment System

Used SMT Equipment | AOI / Automated Optical Inspection

Details: • Ekra Vision Alignment System • Print Format 610 x 510mm • 2 1/2D Inspection • Underside Stencil Cleaner • Closed loop Print Head • Voltage 230 Condition:  Complete and Operational.  Location & Shipping:  USA / FOB Origin Availabil

Lewis & Clark

MPM Accela Stencil Printer

MPM Accela Stencil Printer

Used SMT Equipment | Screen Printers

Vintage: 2006 Details: • 2D System • Automatic Pin Supports • Edge Lock • Windows XP • Software level V3.6.4 • Volt 230 Condition: Complete & Operational Location & Shipping: FOB Origin

Lewis & Clark

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systemation 20mm 230 searches for Companies, Equipment, Machines, Suppliers & Information

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High Throughput Reflow Oven
SMTAI 2024 - SMTA International

Training online, at your facility, or at one of our worldwide training centers"
PCB Handling with CE

High Resolution Fast Speed Industrial Cameras.
Electronic Solutions R3

Thermal Transfer Materials.