Used SMT Equipment: thermal paste height measurement (Page 1 of 4)

ASC International ASC paste thickener 3D SPI-6500 thick paste inspector

ASC International ASC paste thickener 3D SPI-6500 thick paste inspector

Used SMT Equipment | SPI / Solder Paste Inspection

Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser

KingFei SMT Tech

Cyberoptics SE300 Ultra 3D SPI

Cyberoptics SE300 Ultra 3D SPI

Used SMT Equipment | SPI / Solder Paste Inspection

Vintage:  2008 Description:  3D Solder Paste Inspection Details: • 3D sensing  system w/ built-in fiducial camera and lighting • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max PCB width: 20” x 20” • Max inspection

Lewis & Clark

Cyberoptics SE500

Cyberoptics SE500

Used SMT Equipment | SPI / Solder Paste Inspection

CyberOptics SE500 3D SPI Vintage: 2013 3D Height, Volume, and Area Measurements Max PCB Size: 20" x 20" Min PCB Size: 2" x 2" Complete & Operational  

Midwest SMT

Koh Young KY8030-3L

Koh Young KY8030-3L

Used SMT Equipment | SPI / Solder Paste Inspection

Description:  3D Solder Paste Inspection System Vintage:  2016 O/S:  Windows 7 Ultimate Details: •     4-Way High Speed Projection Upgrade (for KY8030-3)        3D Inspection GUI, Gerber conversion software •     SPC Plus software(Statistical P

Lewis & Clark

Pillarhouse JADE MKII

Used SMT Equipment | Soldering - Selective

Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati

Midwest SMT

Vi Technology 3D SPI

Vi Technology 3D SPI

Used SMT Equipment | SPI / Solder Paste Inspection

Make: VI Technologies Model: 3D Solder Paste Inspection Vintage: 2009 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow free ins

Lewis & Clark

Vi Technology 3D XPi 400L

Vi Technology 3D XPi 400L

Used SMT Equipment | Visual Inspection

Make: VI Technolgoies Model: 3D XPi 400L Solder Paste Inspection Vintage: 2008 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow

Lewis & Clark

Cyberoptics LSM

Cyberoptics LSM

Used SMT Equipment | SPI / Solder Paste Inspection

Very Nice Cyberoptics LSM For Sale in Good Working Conditon See attached pictures and information below. •Cyberoptics •Model Number: LSM/LRGE-110 •Serial Number: 5718 •Year December 1994 •Type:Laser Section Microscope •Measures Solder Paste H

1st Place Machinery Inc.

Koh Young SPI KY8030-2 MACHINE

Koh Young SPI KY8030-2 MACHINE

Used SMT Equipment | SPI / Solder Paste Inspection

KOH YOUNG KY8030-2 3D SPI   The World's Best-selling Full 3D Solder Paste Inspection Best-in-class measurement accuracy and inspection reliability Solves shadow problems by utilizing 2-way projection Provides accurate inspection data with real-time P

Qinyi Electronics Co.,Ltd

Koh Young SPI KY8030-3

Koh Young SPI KY8030-3

Used SMT Equipment | SPI / Solder Paste Inspection

Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin

Qinyi Electronics Co.,Ltd

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