Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | Repair/Rework
2008 Hakko FR1418-03 BGA Rework Station Date of Manufacture: 2008 120 VAC , 15A IR Preheater Top Heater 14" x 20" Max Board Size Able to handle: BGA, CGA, QFP, LCC, TSOP and more Windows OS Gantry Style System Condition: Complete & Oper
Used SMT Equipment | Pick and Place/Feeders
Board Size(LxWxT)mm Max.460 x 410 x 2.0㎜,Min.50 x 50 x 0.5㎜ Conveyor flow/speed 좌 → 우 420㎜/sec(with soft-stop) Tact Time 0.16sec/chip,0.38sec/TSOP(32pin) Up ward Vision :0.75sec/QFP(100pin) Repeat ability ±0.06㎜(chip),±0.035㎜(IC)
Used SMT Equipment | Pick and Place/Feeders
Board size L50 x W50mm to L460 (Max. L1200 OP) x W410mm Board thickness 0.5 to 2.0mm &nb
Used SMT Equipment | Pick and Place/Feeders
Board size L50xW50mm – L460 xW410mm Board thickness 0.5mm-2.0mm Flow direction Left to right Conveyor speed Max. 420mm/sec, speed variable, soft stop fuction Placement speed A (NB1) 0.13 sec/CHIP, 0.38 sec/TSOP32 Placement speed B
Used SMT Equipment | AOI / Automated Optical Inspection
Inspects down to 0402 for parts/solder checks Fine pitch QFP's and TSOPS Board Size: 2.5" x 2.5" Minimum / 12" x 12" maximum Capable of checking for missing part, solder quality, electrode lead co
Used SMT Equipment | Pick and Place/Feeders
The Dymexion has been clearly targeted for a well described part of the market namely: - Affordable placement solutions for medium level, prototyping and medium to large but flexible production runs - And an economical placement system for flexible
Used SMT Equipment | Chipshooters / Chip Mounters
Serial #: 4796L-0-10032690 Placements: 05,658,463 / Condition: Good Working, No Missing Parts PCB Size: MAX 457x508mm, MIN 50x50mm, MAX WIDTH is 5 mm, MIN WIDTH is 0.4 mm PCB Flow: Left - Right, Front Left Origin Fixed Rail: Front Fixed
Used SMT Equipment | Pick and Place/Feeders
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
Used SMT Equipment | Pick and Place/Feeders
Type Pick and Place machineDimension off-line (L x W x H) 2150 x 1700 x 1500 mm (+500 mm for signal light)Dimension in-line (L x W x H) 1750 x 1300 x 1500 mm (+500 mm for signal light)Board thickness min. 0.5 mm - max. 4.5 mm thickBoard size min. 30
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